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In this letter we demonstrate the possibility of using the solid ionic conductor Ag2S for the fabrication of sub-100 nnm features in a Cu film. We also evaluate the physical properties of the Cu–Ag2S interface through an electroimpedance spectroscopy study. Cu meander lines of 60 nm in width were obtained and the screening length and the surface adatom concentration of Cu on the interface were also evaluated to be 20 nm and 1012/cm2 respectively.