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• A model to explore the multiphysics characteristic of semiconductors is presented. • The model determines the thermal and mechanical properties of complex patterns. • Results show a strong correlation between thermal and mechanical properties. • Dielectric bands asymmetrically affect thermal and mechanical behavior. • Machine learning can predict one property from another. As semiconductor performance improves through advanced package designs, it becomes important to consider both thermal and mechanical properties. Better understanding their relationship enhances system design and optimization. This study has introduced a numerical method that takes into account both thermal and mechanical fluxes to construct thermal and mechanical property maps for practical application in semiconductor engineering. Furthermore, this paper investigated the relationship between the two properties using the constructed property maps in commercially available semiconductor packages. Owing to the complexity of packaging design patterns, a coupled isoparametric mapping and machine learning (ML) method was introduced to investigate their effects. The model then determines and investigates the anisotropic equivalent thermal and mechanical properties of the commercialized semiconductor packages with complex pattern designs, according to the package materials, volume fractions of each material, and design patterns. This approach pursues more sophistication and practicality compared to simplified composite structure property evaluation models. Additionally, all processes in the algorithm are automated based on ML methods, making them practically applicable in the semiconductor industry. The study shows that there is a strong correlation between the thermal and mechanical characteristics in the complex package patterns. This relationship was able to form a fairly clear category based on the shape of the dielectric band because the dielectric band had significantly different effects on the thermal and mechanical fluxes. The study discussed the physical implications of the similarities and differences between the two behaviors and validated the results of the equivalent properties through finite element (FE) analysis. Finally, the study cross-validates the relationship by showing that information from one flux behavior can be used to predict the other based on the ML method. Based on the results, this paper can provide a better understanding of thermal and mechanical fluxes in semiconductor package patterns for package design and optimization. [ABSTRACT FROM AUTHOR]

• Thermomechanical problem of FGMs sphere with material uncertainties is analyzed. • The interval random uncertainty model is recommended for material parameters. • A data-driven ANN fast calculation for FGMs sphere uncertainties analysis is established. • The volume fraction distribution is optimized for the safety design of the FGMs sphere. Mechanical analysis and optimal design for functionally graded materials (FGMs) structures are significant. The present paper analyzes the parameter uncertainties problem for the thermomechanical response of the FGMs spherical shells with volume fraction power distribution. Here, the interval random uncertainty model is recommended to describe the uncertainties of each component of material parameters in FGMs, and a data-driven artificial neural network (ANN) fast calculation for FGMs spherical shells thermomechanical problems with uncertainties analysis is established and trained. The thermomechanical coupling response analysis and volume fraction optimization analysis of the FGMs spherical shell with material uncertainties are realized for zirconia-titanium FGMs, with the maximum normalized Von Mises stress as the structural safety index and the ANN as the fast calculation method. In addition, the Von Mises stress of the FGMs spherical shell and a ZrO 2 -Ti alloy double-layer spherical shell under different loads is compared. The results show that material parameter uncertainties, especially those in Young's modulus, thermal expansion coefficient, and uniaxial yield limit significantly affect structural safety. The structural safety index λ calculated based on the volume fraction optimization design of FGMs spherical shell is significantly lower than that of the ZrO 2 -Ti alloy double-layer. The ANN method greatly improves the computational efficiency for uncertain problems and maintains high accuracy, compared with the statistical analysis after many calculations by randomly selecting material parameters. This study provides a path for the safety design of FGMs structures with uncertain parameters. [ABSTRACT FROM AUTHOR]