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The Si-doped AlN films were grown on sapphire (0001) by pulsed sputtering deposition (PSD), and their structural and electrical properties were investigated. A combination of PSD and high-temperature annealing process enabled the growth of high-quality AlN (0001) epitaxial films on sapphire (0001) substrates with atomically flat stepped and terraced surfaces. The transmission electron microscopy observations revealed that the majority of the threading dislocations in AlN belonged to the mixed- or edge-type, with densities of 2.8 × 108 and 4.4 × 109 cm−2, respectively. The Si-doping of AlN by PSD yielded a clear n-type conductivity with a maximum electron mobility of 44 cm2 V−1 s−1, which was the highest value reported for AlN that was grown on sapphire. These results clearly demonstrated the strong potential of the PSD technique for growing high-quality conductive n-type AlN on sapphire.

We report a systematic investigation of the transport properties of highly degenerate electrons in Ge-doped and Si-doped GaN epilayers prepared using the pulsed sputtering deposition (PSD) technique. Secondary-ion mass spectrometry and Hall-effect measurements revealed that the doping efficiency of PSD n-type GaN is close to unity at electron concentrations as high as 5.1 × 1020 cm−3. A record low resistivity for n-type GaN of 0.16 mΩ cm was achieved with an electron mobility of 100 cm2 V−1 s−1 at a carrier concentration of 3.9 × 1020 cm−3. We explain this unusually high electron mobility of PSD n-type GaN within the framework of conventional scattering theory by modifying a parameter related to nonparabolicity of the conduction band. The Ge-doped GaN films show a slightly lower electron mobility compared with Si-doped films with the same carrier concentrations, which is likely a consequence of the formation of a small number of compensation centers. The excellent electrical properties presented in this letter clearly demonstrate the striking advantages of the low-temperature PSD technique for growing high-quality and highly conductive n-type GaN.

We demonstrated the crystal growth of wafer-scale hexagonal boron nitride (hBN) films on AlN template substrates by pulsed sputtering deposition using Fe catalysts. It was found that hBN films with high crystalline quality were formed at the hetero-interfaces between the Fe catalytic layers and the AlN templates. The full width at half maximum value of the E2g Raman spectrum for the hBN film was as small as 5.1 cm−1. The hBN film showed a highly c-axis-oriented structure and a strong near-band-edge deep ultraviolet emission at room temperature. The present results indicate that the sputter synthesis of hBN films via interface segregation opens a new pathway for the wafer-scale production of high-quality hBN films, and we envisage its potential applications in the fabrication of prospective hBN-based optoelectronic devices.

High-quality N-polar GaN epitaxial films with an atomically flat surface were grown on sapphire (0001) via pulsed sputtering deposition, and their structural and electrical properties were investigated. The crystalline quality of N-polar GaN improves with increasing film thickness and the full width at half maximum values of the x-ray rocking curves for 0002 and 101¯2 diffraction were 313 and 394 arcsec, respectively, at the film thickness of 6μm. Repeatable p-type doping in N-polar GaN films was achieved using Mg dopant, and their hole concentration and mobility can be controlled in the range of 8 × 1016–2 × 1018 cm−3 and 2–9 cm2V−1s−1, respectively. The activation energy of Mg in N-polar GaN based on a temperature-dependent Hall measurement was estimated to be 161 meV, which is comparable to that of the Ga-polar GaN. Based on these results, we demonstrated the fabrication of N-polar InGaN-based light emitting diodes with the long wavelength up to 609 nm.

We have grown Mg-doped GaN films with low residual hydrogen concentration using a low-temperature pulsed sputtering deposition (PSD) process. The growth system is inherently hydrogen-free, allowing us to obtain high-purity Mg-doped GaN films with residual hydrogen concentrations below 5 × 1016 cm−3, which is the detection limit of secondary ion mass spectroscopy. In the Mg profile, no memory effect or serious dopant diffusion was detected. The as-deposited Mg-doped GaN films showed clear p-type conductivity at room temperature (RT) without thermal activation. The GaN film doped with a low concentration of Mg (7.9 × 1017 cm−3) deposited by PSD showed hole mobilities of 34 and 62 cm2 V−1 s−1 at RT and 175 K, respectively, which are as high as those of films grown by a state-of-the-art metal-organic chemical vapor deposition apparatus. These results indicate that PSD is a powerful tool for the fabrication of GaN-based vertical power devices.