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The deliberate use of channeling to control depth profiles has come of age in the application to CMOS imaging sensor device manufacturing. In order to enable the true zero implant application on VIISta3000, we have optimized beam incidence angle control, using beam optics models and experimental measurements. The experiment measurement and the beam optics analysis results agree, showing a variation of less than 0.03° (1σ) across the wafer and from wafer to wafer. Achieving this accuracy in a manufacturing environment requires careful calibration and tight control of the collimator magnet and the mechanical scan system. In this paper we discuss the root cause of beam incidence angle variation on VIISta3000 and explain the calibration and optimization used to insure the consistent minimized beam incidence angle. We show experimental data, including ThermaWave and SIMS profiles. [ABSTRACT FROM AUTHOR]

Wafer temperature during implant has a dominate effect on the amorphous layer thickness and post anneal residual defects which can result in difference in device performance and difficulties in tool matching between different implant systems, namely batch type vs. single wafer implanter and spot beam vs. ribbon beam system. Although the implant temperature set point can be well defined and controlled, the instantaneous temperature on wafer during implant is quite complicated interactions among beam shape, dose rate, duty cycle and cooling system to the behavior of defect generation and dynamic annealing. A batch system, iStar, and a single wafer system, iPulsar, which delivers both spot beam and ribbon beam with cold implant capability were used to study the effect of implant temperature to the post anneal residual defects by BF2 15 keV 3×1015 cm-2 implant after 850 °C/30s anneal. Measurements from Rs, SIMS, plane view TEM are compared and analyzed. The results by ribbon beam and spot beam are also compared. [ABSTRACT FROM AUTHOR]

For a long time, the traceability was applied only for management reasons, but with the advent of new communication and information technologies more and more used in the logistic medium, the notion of the traceability became new extensive to meet the new market needs in term of information by ensuring accessibility the data characteristic or been dependent on the product throughout its life cycle. On the basis of this postulate, we tried to raise some questions of research, beginning by the presentation of the progress achieved, assumptions and objective relating to the traceability, in the second time we mentioned principal work by showing how evolved the scientific question especially the information systems integrating the traceability were developed very little in the literature. Based on what was developed in the first part, we present our generic modeling approach of communicating product “smart object”, able to take into account the various essential elements for its traceability: the product in its various states, various operations carried out on the product, resources used, its localization, and interactions between the product and its environment carried out on the basis of whole of service. In order to validate our generic modeling, a case of study representing an application in a context of food industry is presented. [ABSTRACT FROM AUTHOR]