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The machining methods such as waterjet cutting, milling, grinding, lapping, etc. are usually used to manufacture glass fiber reinforced composites (GFRCs) parts. Damages will be produced unavoidably in the machining process, no matter which machining method is employed. Subsurface damage is one of the important parameters to evaluate the surface layer damages. The detection method for the subsurface damages of glass fiber reinforced glass matrix (glass/glass) composite after machining is researched. The characteristics of subsurface damages of glass/glass composite after waterjet cutting, milling, grinding and lapping are investigated mainly, when the fiber direction is either perpendicular or parallel to the cutting surface.

Superalloys are widely used in the aeronautic and astronautic industries owing to their excellent properties in aspects of high-temperature strength, heat stability and thermal fatigue resistance. However, the severe loading of grinding wheel and the poor integrity of grinding surface usually become the problem in grinding of superalloys with conventional grinding wheels. In this paper an experimental study was carried out to investigate the grinding characteristics of superalloys with microcrystalline alumina abrasive wheel. The roughness of grinding surface was tested, on which the effects of the grinding parameters were analyzed. Study results indicated that low loading of grinding wheel and high quality of grinding surface (Ra 0.2 μm) were obtained. The grinding parameters were optimized based on the experiment results.

This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra

A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.