1. Curing Behavior of Siloxane-Containing Epoxy
- Author
-
Wen Bing Sun and Ou Sheng Zhang
- Subjects
Materials science ,General Engineering ,Activation energy ,Epoxy ,Catalysis ,chemistry.chemical_compound ,Differential scanning calorimetry ,Zero order kinetics ,chemistry ,Siloxane ,visual_art ,Polymer chemistry ,visual_art.visual_art_medium ,Bisphenol A diglycidyl ether ,Curing (chemistry) - Abstract
The curing processes of a novelly synthesized siloxane-containing epoxy resin (SE) and bisphenol A diglycidyl ether (CYD-128) were investigated using dynamic differential scanning calorimetry (DSC), and analyzed by three different methods. The results show that while SE has a lower initial curing temperature and a smaller pre-exponential factor than CYD-128, their curing processes belong to first order kinetic reaction. All the three dynamic methods verified mutually reveal that SE with more catalytic hydroxyls possesses lower activation energy and exhibits a stronger curing reactivity than CYD-128.
- Published
- 2011
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