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We have been developing an advanced general-purpose computational mechanics system, named ADVENTURE, which is designed to be able to analyze a three dimensional finite element model of arbitrary shape over 100 million Degrees Of Freedom (DOF) mesh. The one of main process modules for solid analysis, named ADVENTURE_Solid, is based the hierarchical domain decomposition parallel algorithm and employs the balancing domain decomposition as a solution technique for linearized equations. The ADVENTURE_Solid has been successfully implemented on a single PC, PC clusters and MPPs with high parallel performances. Since the software has become a quite large system, it is not easy to install or operate the system on parallel machines by users. In this paper, to operate such a system from a client PC through the network, the Web-based CAE system is developed.

International audience; The ACCENT Project (FP7- AAT- 2007- RTD-1) will allow the European Aero Engine manufacturers to improve their competitiveness by applying adaptive control techniques to the manufacturing of their components. For the critical rotating parts of aircraft engines, the surface integrity generated after machining is a key factor on the life cycle. In this context, one particular attention has to be carried out on tool condition. The aim of this paper is to define a monitoring approach able to detect the tool condition and machining disturbances. The main failure modes characterizing this particular Nickel base drilling and the apparition of embedded chips over the machined surface were identified. By experimental techniques, cartography of failure modes was performed. The results show that flank wear and notch are the main failure modes limiting the tool life. For some cutting conditions, the tool failure occurs after the first hole due to the important cutting forces. Some interesting combinations are made between the spindle current/accelerometers/ thrust force and flank wear, tool breakage and notch. Before these correlations, a detailed signal analysis was performed, considering different disturbing phenomena, such as chips evacuation problem. Finally, a "synopsis" for process monitoring is proposed, considering the analyzed phenomena.