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A liquid metal based electronic ink is developed by mixing GaIn alloy with Ni powders. The material exhibits significantly superior adhesivity to paper and other various substrates, which guarantees stable and flexible electrical connection via direct writing. More details can be found in the article number 1800571 by Hao Chang, Qian Wang, Wei Rao, and co‐authors. [ABSTRACT FROM AUTHOR]

Liquid metals such as gallium and its alloys can be printed on various substrates to form electronic circuits. However, up to now there are still few methods for the direct writing of liquid metals on common printed paper. Here, a novel conductive material prepared by adding metal powder to a gallium alloy is introduced. The proposed material exhibits low liquidity, excellent plasticity, significantly enhanced adhesivity to paper substrates, which guarantee the stable and flexible electrical connection. The oxide film wrapping the nickel powder forms a skeleton for additional oxidation products, resulting in superior adhesion to paper. In addition, several paper flexible electronic applications are showcased to demonstrate the practical value and reparability of this material. This work paves the way for the design of a facile method of preparing paper electronics. Liquid metals usually have poor wettability with printed paper. Here, mixture of nickel powder and EGaIn alloy (GIN) made by mixing EGaIn and nickel powder has low liquidity, excellent plasticity, and significantly enhanced adhesivity to paper substrates. Especially, an electrode cut by a sharp knife can be fixed simply. The superior and rapid repairable capability demonstrates the great potential of GIN material for practical application. [ABSTRACT FROM AUTHOR]