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15 results on '"SUN Rong"'

1. Correction to Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates

Author

Ying, Junfeng, primary, Tan, Xue, additional, Lv, Le, additional, Wang, Xiangze, additional, Gao, Jingyao, additional, Yan, Qingwei, additional, Ma, Hongbing, additional, Nishimura, K., additional, Li, He, additional, Yu, Jinhong, additional, Liu, Te-Huan, additional, Xiang, Rong, additional, Sun, Rong, additional, Jiang, Nan, additional, Wong, Chingping, additional, Maruyama, Shigeo, additional, Lin, Cheng-Te, additional, and Dai, Wen, additional

Published
2022
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2. Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2Tx MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface

Author

Tan, Xue, primary, Liu, Te-Huan, additional, Zhou, Wenjiang, additional, Yuan, Qilong, additional, Ying, Junfeng, additional, Yan, Qingwei, additional, Lv, Le, additional, Chen, Lu, additional, Wang, Xiangze, additional, Du, Shiyu, additional, Wan, Yan-Jun, additional, Sun, Rong, additional, Nishimura, Kazuhito, additional, Yu, Jinhong, additional, Jiang, Nan, additional, Dai, Wen, additional, and Lin, Cheng-Te, additional

Published
2022
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3. Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates

Author

Ying, Junfeng, primary, Tan, Xue, additional, Lv, Le, additional, Wang, Xiangze, additional, Gao, Jingyao, additional, Yan, Qingwei, additional, Ma, Hongbing, additional, Nishimura, K., additional, Li, He, additional, Yu, Jinhong, additional, Liu, Te-Huan, additional, Xiang, Rong, additional, Sun, Rong, additional, Jiang, Nan, additional, Wong, Chingping, additional, Maruyama, Shigeo, additional, Lin, Cheng-Te, additional, and Dai, Wen, additional

Published
2021
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6. Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader

Author

Yan, Qingwei, primary, Dai, Wen, additional, Gao, Jingyao, additional, Tan, Xue, additional, Lv, Le, additional, Ying, Junfeng, additional, Lu, Xiaoxin, additional, Lu, Jibao, additional, Yao, Yagang, additional, Wei, Qiuping, additional, Sun, Rong, additional, Yu, Jinhong, additional, Jiang, Nan, additional, Chen, Ding, additional, Wong, Ching-Ping, additional, Xiang, Rong, additional, Maruyama, Shigeo, additional, and Lin, Cheng-Te, additional

Published
2021
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7. Ultrathin Densified Carbon Nanotube Film with “Metal-like” Conductivity, Superior Mechanical Strength, and Ultrahigh Electromagnetic Interference Shielding Effectiveness

Author

Wan, Yan-Jun, primary, Wang, Xiao-Yun, additional, Li, Xing-Miao, additional, Liao, Si-Yuan, additional, Lin, Zhi-Qiang, additional, Hu, You-Gen, additional, Zhao, Tao, additional, Zeng, Xiao-Liang, additional, Li, Chun-Hong, additional, Yu, Shu-Hui, additional, Zhu, Peng-Li, additional, Sun, Rong, additional, and Wong, Ching-Ping, additional

Published
2020
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8. Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

Author

Dai, Wen, primary, Ma, Tengfei, additional, Yan, Qingwei, additional, Gao, Jingyao, additional, Tan, Xue, additional, Lv, Le, additional, Hou, Hao, additional, Wei, Qiuping, additional, Yu, Jinhong, additional, Wu, Jianbo, additional, Yao, Yagang, additional, Du, Shiyu, additional, Sun, Rong, additional, Jiang, Nan, additional, Wang, Yan, additional, Kong, Jing, additional, Wong, Chingping, additional, Maruyama, Shigeo, additional, and Lin, Cheng-Te, additional

Published
2019
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9. Highly Compressive Boron Nitride Nanotube Aerogels Reinforced with Reduced Graphene Oxide

Author

Wang, Mingmei, primary, Zhang, Tao, additional, Mao, Dasha, additional, Yao, Yimin, additional, Zeng, Xiangliang, additional, Ren, Linlin, additional, Cai, Qiran, additional, Mateti, Srikanth, additional, Li, Lu Hua, additional, Zeng, Xiaoliang, additional, Du, Guoping, additional, Sun, Rong, additional, Chen, Ying, additional, Xu, Jian-Bin, additional, and Wong, Ching-Ping, additional

Published
2019
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10. A Paper-Like Inorganic Thermal Interface Material Composed of Hierarchically Structured Graphene/Silicon Carbide Nanorods

Author

Dai, Wen, primary, Lv, Le, additional, Lu, Jibao, additional, Hou, Hao, additional, Yan, Qingwei, additional, Alam, Fakhr E., additional, Li, Yifan, additional, Zeng, Xiaoliang, additional, Yu, Jinhong, additional, Wei, Qiuping, additional, Xu, Xiangfan, additional, Wu, Jianbo, additional, Jiang, Nan, additional, Du, Shiyu, additional, Sun, Rong, additional, Xu, Jianbin, additional, Wong, Ching-Ping, additional, and Lin, Cheng-Te, additional

Published
2019
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13. Flexible Asymmetrical Solid-State Supercapacitors Based on Laboratory Filter Paper

Author

Zhang, Leicong, Zhu, Pengli, Zhou, Fengrui, Zeng, Wenjin, Su, Haibo, Li, Gang, Gao, Jihua, Sun, Rong, and Wong, Ching-ping

Abstract

In this study, a flexible asymmetrical all-solid-state supercapacitor with high electrochemical performance was fabricated with Ni/MnO2filter paper (FP) as the positive electrode and Ni/active carbon (AC)filter paper as negative electrode, separated with poly(vinyl alcohol) (PVA)–Na2SO4electrolyte. A simple procedure, such as electroless plating, was introduced to prepare the Ni/MnO2–FP electrode on the conventional laboratory FP, combined with the subsequent step of electrodeposition. Electrochemical results show that the as-prepared electrodes display outstanding areal specific capacitance (1900 mF/cm2at 5 mV/s) and excellent cycling performance (85.1% retention after 1000 cycles at 20 mA/cm2). Such a flexible supercapacitor assembled asymmetrically in the solid state exhibits a large volume energy density (0.78 mWh/cm3) and superior flexibility under different bending conditions. It has been demonstrated that the supercapacitors could be used as a power source to drive a 3 V light-emitting diode indicator. This study may provide an available method for designing and fabricating flexible supercapacitors with high performance in the application of wearable and portable electronics based on easily available materials.

Published
2016
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14. Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti3C2TxMXene/Graphene Framework Connected by a Hydrogen-Bonded Interface

Author

Tan, Xue, Liu, Te-Huan, Zhou, Wenjiang, Yuan, Qilong, Ying, Junfeng, Yan, Qingwei, Lv, Le, Chen, Lu, Wang, Xiangze, Du, Shiyu, Wan, Yan-Jun, Sun, Rong, Nishimura, Kazuhito, Yu, Jinhong, Jiang, Nan, Dai, Wen, and Lin, Cheng-Te

Abstract

The rapid increase of operation speed, transmission efficiency, and power density of miniaturized devices leads to a rising demand for electromagnetic interference (EMI) shielding and thermal management materials in the semiconductor industry. Therefore, it is essential to improve both the EMI shielding and thermal conductive properties of commonly used polyolefin components (such as polyethylene (PE)) in electronic systems. Currently, melt compounding is the most common method to fabricate polyolefin composites, but the difficulty of filler dispersion and high resistance at the filler/filler or filler/matrix interface limits their properties. Here, a fold fabrication strategy was proposed to prepare PE composites by incorporation of a well-aligned, seamless graphene framework premodified with MXene nanosheets into the matrix. We demonstrate that the physical properties of the composites can be further improved at the same filler loading by nanoscale interface engineering: the formation of hydrogen bonds at the graphene/MXene interface and the development of a seamlessly interconnected graphene framework. The obtained PE composites exhibit an EMI shielding property of ∼61.0 dB and a thermal conductivity of 9.26 W m–1K–1at a low filler content (∼3 wt %, including ∼0.4 wt % MXene). Moreover, other thermoplastic composites with the same results can also be produced based on our method. Our study provides an idea toward rational design of the filler interface to prepare high-performance polymer composites for use in microelectronics and microsystems.

Published
2022
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15. Enhanced Electromagnetic Shielding and Thermal Conductive Properties of Polyolefin Composites with a Ti 3 C 2 T x MXene/Graphene Framework Connected by a Hydrogen-Bonded Interface.

Author

Tan X, Liu TH, Zhou W, Yuan Q, Ying J, Yan Q, Lv L, Chen L, Wang X, Du S, Wan YJ, Sun R, Nishimura K, Yu J, Jiang N, Dai W, and Lin CT

Abstract

The rapid increase of operation speed, transmission efficiency, and power density of miniaturized devices leads to a rising demand for electromagnetic interference (EMI) shielding and thermal management materials in the semiconductor industry. Therefore, it is essential to improve both the EMI shielding and thermal conductive properties of commonly used polyolefin components (such as polyethylene (PE)) in electronic systems. Currently, melt compounding is the most common method to fabricate polyolefin composites, but the difficulty of filler dispersion and high resistance at the filler/filler or filler/matrix interface limits their properties. Here, a fold fabrication strategy was proposed to prepare PE composites by incorporation of a well-aligned, seamless graphene framework premodified with MXene nanosheets into the matrix. We demonstrate that the physical properties of the composites can be further improved at the same filler loading by nanoscale interface engineering: the formation of hydrogen bonds at the graphene/MXene interface and the development of a seamlessly interconnected graphene framework. The obtained PE composites exhibit an EMI shielding property of ∼61.0 dB and a thermal conductivity of 9.26 W m -1 K -1 at a low filler content (∼3 wt %, including ∼0.4 wt % MXene). Moreover, other thermoplastic composites with the same results can also be produced based on our method. Our study provides an idea toward rational design of the filler interface to prepare high-performance polymer composites for use in microelectronics and microsystems.

Published
2022
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