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Your search keyword '"Sokolov, Alexei P."' showing total 11 results
Start Over Author "Sokolov, Alexei P." Journal acs applied materials & interfaces
11 results on '"Sokolov, Alexei P."'

9. Effect of Binder Architecture on the Performance of Silicon/Graphite Composite Anodes for Lithium Ion Batteries

Author

Cao, Peng-Fei, primary, Naguib, Michael, additional, Du, Zhijia, additional, Stacy, Eric, additional, Li, Bingrui, additional, Hong, Tao, additional, Xing, Kunyue, additional, Voylov, Dmitry N., additional, Li, Jianlin, additional, Wood, David L., additional, Sokolov, Alexei P., additional, Nanda, Jagjit, additional, and Saito, Tomonori, additional

Published
2018
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11. Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

Author

Yegin, Cengiz, Nagabandi, Nirup, Feng, Xuhui, King, Charles, Catalano, Massimo, Oh, Jun Kyun, Talib, Ansam J., Scholar, Ethan A., Verkhoturov, Stanislav V., Cagin, Tahir, Sokolov, Alexei V., Kim, Moon J., Matin, Kaiser, Narumanchi, Sreekant, and Akbulut, Mustafa

Abstract

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrixwhich are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2–28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38–0.56 mm2K/W for a typical bond-line thickness of 30–50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

Published
2013
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