Author: "WANG FangCheng" / Journal: 2022 23rd international conference on electronic packaging technology (icept) - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"WANG FangCheng"' showing total 3 results

Start Over Author "WANG FangCheng" Journal 2022 23rd international conference on electronic packaging technology (icept)

3 results on '"WANG FangCheng"'

1. Nondestructive Laser Debonding of Designable Responsive and Buffer Layers for Wafer Level Packaging

Author: Wang, Fangcheng, primary, Liu, Qiang, additional, Wang, Xuefan, additional, Li, Jinhui, additional, Zhang, Guoping, additional, and Sun, Rong, additional
Published: 2022
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2. A Novel Single-Layer High-Temperature-Resistant Adhesive Layer Applied in Advanced Wafer-Level Packaging

Author: Dai, Wenxue, primary, Liu, Qiang, additional, Li, Zhipeng, additional, Li, Kang, additional, Wang, Xuefan, additional, Wang, Fangcheng, additional, Li, Jinhui, additional, Sun, Rong, additional, and Zhang, Guoping, additional
Published: 2022
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3. Temporary bonding system with photopolymer release layer for 365nm UV debonding without laser

Author: Wang, Xuefan, primary, Liu, Qiang, additional, Wang, Fangcheng, additional, Li, Jinhui, additional, Li, Zhipeng, additional, Dai, Wenxue, additional, Huang, Mingqi, additional, Li, Kang, additional, Bai, Yun, additional, Zhang, Guoping, additional, and Sun, Rong, additional
Published: 2022
Full Text: View/download PDF

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