1. Reactive Molecular Dynamics Simulation on Bulk and Shear Modulus of Polyimide-POSS Composites at Low Temperature
- Author
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Cao Jianmei, Bingqiang Wang, Yunqi Xing, Jiangqiao Long, Ji Wei Zhang, Haoren Jiang, and Wu Yuanxiang
- Subjects
Bulk modulus ,Materials science ,Composite number ,Nanoparticle ,02 engineering and technology ,010402 general chemistry ,021001 nanoscience & nanotechnology ,01 natural sciences ,0104 chemical sciences ,Stress (mechanics) ,Shear modulus ,Molecular dynamics ,Thermal stability ,Composite material ,0210 nano-technology ,Polyimide - Abstract
Few studies have focused on effect of nanoparticles on mechanical properties of PI film at low temperature. In this paper, one king of POSS namely polyphenylsilsesquioxane (PPSQ) was added to PI molecules, and the mechanical property of PI-POSS composites were studied by molecular dynamics. The variation of bulk modulus and shear modulus of the composites at low temperature was analyzed. Bulk modulus and shear modulus of Polyimide-POSS composite model would decrease as the temperature rose. Compared with the pristine PI model, the bulk and shear modulus of composite model was smaller.
- Published
- 2020