Author: "Murugesan, Mariappan" / Journal: 2015 ieee 65th electronic components and technology conference (ectc) - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Murugesan, Mariappan"' showing total 3 results

Start Over Author "Murugesan, Mariappan" Journal 2015 ieee 65th electronic components and technology conference (ectc)

3 results on '"Murugesan, Mariappan"'

1. Challenges of high-robustness self-assembly with Cu/Sn-Ag microbump bonding for die-to-wafer 3D integration

Author: Suzuki, Taku, primary, Asami, Kazushi, additional, Kitamura, Yasuhiro, additional, Fukushima, Takafumi, additional, Nagai, Chisato, additional, Bea, Jichoel, additional, Sato, Yutaka, additional, Murugesan, Mariappan, additional, Lee, Kang-wook, additional, and Koyanagi, Mitsumasa, additional
Published: 2015
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2. Three-dimensional integration technology for sensor application using 5-µm-pitch au cone bump connections

Author: Motoyoshi, Makoto, primary, Yanagimura, Kohki, additional, Takanohashi, Junichi, additional, Murugesan, Mariappan, additional, Aoyagi, Masahiro, additional, and Koyanagi, Mitsumasa, additional
Published: 2015
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3. Development of highly-reliable microbump bonding technology using self-assembly of NCF-covered KGDs and multi-layer 3D stacking challenges

Author: Ito, Yuka, primary, Murugesan, Mariappan, additional, Kino, Hisashi, additional, Fukushima, Takafumi, additional, Lee, Kang-Wook, additional, Choki, Koji, additional, Tanaka, Tetsu, additional, and Koyanagi, Mitsumasa, additional
Published: 2015
Full Text: View/download PDF

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