Author: "Sleeckx, E." / Journal: 2014 ieee 16th electronics packaging technology conference (eptc) - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Sleeckx, E."' showing total 2 results

Start Over Author "Sleeckx, E." Journal 2014 ieee 16th electronics packaging technology conference (eptc)

2 results on '"Sleeckx, E."'

1. Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

Author: Podpod, A., primary, Demeurisse, C., additional, Gerets, C., additional, Rebibis, K. J., additional, Capuz, G., additional, Duval, F., additional, Phommahaxay, A., additional, Sleeckx, E., additional, Struyf, H., additional, Miller, R. A., additional, Beyer, G., additional, and Beyne, E., additional
Published: 2014
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2. Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials

Author: Cadacio, F., primary, Beyer, G., additional, Beyne, E., additional, Rebibis, K. J., additional, Capuz, G., additional, Daily, R., additional, Gerets, C., additional, Sleeckx, E., additional, Duval, F., additional, Wang, T., additional, and Miller, R. A., additional
Published: 2014
Full Text: View/download PDF

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