1. Package-on-package for chip cooling with embedded fluidics
- Author
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Tiffany Chua, Sarkis Babikian, G. P. Li, Mark Bachman, and Liang Wu
- Subjects
Materials science ,Computer cooling ,business.industry ,Electrical engineering ,Chip ,Coolant ,Printed circuit board ,Heat transfer ,Package on package ,Computer Science::Mathematical Software ,Fluidics ,Physics::Atomic Physics ,Integrated circuit packaging ,business ,ComputingMilieux_MISCELLANEOUS - Abstract
Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm2. Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a “package-on-package” construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.
- Published
- 2012
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