1. Results from the first prototype of large 3D active edge sensors
- Author
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Jasmine Hasi, Angela Kok, C.J. Kenney, C. Fleta, Giovanni Darbo, T-E Hansen, Anand Summanwar, G-F Dalla Betta, Nicolas Lietaer, Giulio Pellegrini, Sherwood Parker, Manuel Lozano, C. Da Via, and Maurizio Boscardin
- Subjects
Fabrication ,Materials science ,Wafer bonding ,Active edge ,business.industry ,Detector ,Process (computing) ,Deep reactive-ion etching ,Optoelectronics ,Electrical measurements ,business ,Radiation hardening - Abstract
3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.
- Published
- 2011
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