Author: "Travaly, Y." / Journal: 2009 ieee international conference on 3d system integration - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Travaly, Y."' showing total 3 results

Start Over Author "Travaly, Y." Journal 2009 ieee international conference on 3d system integration

3 results on '"Travaly, Y."'

1. Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping

Author: Civale, Y., primary, Tezcan, D. Sabuncuoglu, additional, Philipsen, H.G.G., additional, Jaenen, P., additional, Agarwal, R., additional, Duval, F., additional, Soussan, P., additional, Travaly, Y., additional, and Beyne, E., additional
Published: 2009
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2. 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)

Author: Van Olmen, J., primary, Coenen, J., additional, Dehaene, W., additional, De Meyer, K., additional, Huyghebaert, C., additional, Jourdain, A., additional, Katti, Guruprasad, additional, Mercha, A., additional, Rakowski, M., additional, Stucchi, M., additional, Travaly, Y., additional, Beyne, E., additional, and Swinnen, B., additional
Published: 2009
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3. TSV metrology and inspection challenges.

Author: Alapati, R., Travaly, Y., Van Olmen, J., Teixeira, R.C., Vaes, J., van Cauwenbergh, M., Jourdain, A., Verbinnen, G., Marcuccilli, G., Florence, G., Wolfling, S., Pelissier, C., Haiping Zhang, Sinha, J., Machura, A., and Malik, I.
Published: 2009
Full Text: View/download PDF

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