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Three-dimensional optoelectronic integration can be achieved in SOI wafers using the process of SIMOX 3D sculpting. Micro-resonators, with unloaded Q of 8000 and extinction ratio >20 dB, were fabricated in a buried silicon layer and MOS transistor structures were fabricated on the surface silicon layer using a patterned SIMOX process.

Stimulated Raman scattering in SOI waveguides has received significant attention recently with the demonstration of pulsed, continuous wave Raman lasers and high gain Raman amplification. However, the limited bandwidth of the Raman signal in silicon (/spl sim/105GHz) renders this scheme unsuitable for broadband WDM amplification unless multi-pumping scheme is employed. Large pulsed gain and lasing have been reported in GeSi waveguides. The SiGe on SOI platform represents a Raman medium with a flexible gain spectrum.