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The authors developed a computer modeling program which solves the one-dimensional heat flow problem for a sequence of layers of material; dissipated power waveform is input in the form of an analytical function of time and junction temperature; heat flow at the borders may be given as constant temperature or zero gradient (or any combination thereof). The program was used to simulating as closely as possible medium power automotive suppresser diodes currently produced in Baneasa, under real pulse-test conditions. Predicted temperatures have been found to agree with experimental findings, and suggest as a possible failure trigger mechanism the melting of the solder a the pellet-substrate interface.

A building-in reliability technology was implemented to the manufacturing of Schottky power diodes. The main input variables (process and control parameters) contributing to the reliability were identified, optimised and monitored in the purpose to increase the reliability level.

Statistical analyses were used to build an efficient reliability monitor for power semiconductor devices. Benefits for the device manufacturing are obtained.