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Photomasks, the printing masters for the fabrication of integrated circuits, have become a necessity of modern semiconductor manufacturing. This book details the science and technology of industrial photo mask production, including fundamental principles, industrial production flows, and technological evolution.

Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices. The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching processes coming from chemistry, physics, and engineering. The book is divided into two sections: the wet and dry etching processes are presented in the first, general, section, which provides the scientific fundamentals, while a catalog of etching bath composition, etching instructions, and parameters can be found in the second section. This section will enhance the comprehension of the general section and also give an overview of data that are essential in practice.

This book elucidates the reasons underlying the lasting success of DNQ/N resist systems by examining the correlation between the chemical structure of the components and the photoresist performance. The basic chemistry of both DNQ sensitizers and novolak resins are explored. Focus also is placed on the chemical basis of application-related facets of the lithographic process. Methods of increasing process performance, such as image reversal, top layer imaging, antireflection layers, and phase shift technology are treated.