30 results on '"Plötner M"'
Search Results
2. Phase-Stable, Multi-μJ Femtosecond Pulses from a Repetition-Rate Tunable Ti:Sa-Oscillator-Seeded Yb-Fiber Amplifier
3. Compact Ultrafast Oscillators and High Performance Ultrafast Amplifiers Based on Ytterbium-Doped Fibers
4. High-flux ultrafast extreme-ultraviolet photoemission spectroscopy at 18.4 MHz pulse repetition rate
5. Hybridization of Cooled Mosaic Sensors by Indium-Bumps
6. Modal content measurements (S^2) of negative curvature hollow-core photonic crystal fibers
7. Phase-stable, multi-µJ femtosecond pulses from a repetition-rate tunable Ti:Sa-oscillator-seeded Yb-fiber amplifier
8. Modal content analysis of hollow core Kagome fibers
9. Demonstration of >5kW emissions with good beam quality from two different 7:1 all-glass fiber coupler-types
10. High power incoherent beam combining by an all-glass 7:1 fiber coupler with high beam quality
11. Fabrication and evaluation of a 500 W cladding-light stripper
12. Fabrication and evaluation of a 500 W cladding-light stripper
13. Pulse dynamics in a passively mode-locked chirped-pulse fiber laser
14. STRUCTURE AND MAGNETIC PROPERTIES OF Sr2FeMoO6±δ NANOSIZED FILMS
15. ELECTRICAL PROPERTIES OF NANOSTRUCTURED VANADIUM OXIDE THIN FILMS ON SILICON SUBSTRATES
16. Aluminum oxide film as gate dielectric for organic FETs: Anodization and characterization
17. Environmentally-stable wave-breaking-free mode-locked Yb-doped all-fiber laser
18. Experimental and numerical study of pulse dynamics in positive net-cavity dispersion mode-locked Yb-doped all-fiber lasers
19. Self-starting passively mode-locked chirped-pulse fiber oscillator
20. Experiments with organic field effect transistors based on polythiophene and thiophene oligomers
21. Endpoint detection method for CMP of copper
22. Influence of process parameters on chemical-mechanical polishing of copper
23. Dielectric barriers for Cu metallization systems
24. The interaction between different barrier metals and the copper surface during the chemical-mechanical polishing
25. Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads
26. Chemical-mechanical polishing of copper for interconnect formation
27. Characterization of Cu chemical mechanical polishing by electrochemical investigations
28. Chemical mechanical polishing of copper for multilevel metallization
29. Deformation properties of indium-based solders at 294 and 77 K
30. Aspects of Indium Solder Bumping and Indium Bump Bonding Useful for Assembling Cooled Mosaic Sensors
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.