42 results on '"Nogami, Takeshi"'
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2. Interconnect Processing: Integration, Dielectrics, Metals
3. Impact of nanosecond laser annealing on vacancies in electroplated Cu films studied by monoenergetic positron beams
4. Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
5. (Invited) Innovations to Enable Extension of Cu Interconnects and Shift to Alternative Conductor
6. (Invited) Scaling of Copper Interconnection As Opposed to Alternative Conductors
7. Advanced BEOL Interconnects
8. Novel low k Dielectric materials for nano device interconnect technology
9. Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
10. (Invited) Scaling of Copper Interconnection As Opposed to Alternative Conductors
11. PEALD Ru Liner Conformality and Cu Trench Fill Characteristics
12. Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
13. Overview of interconnect technology for 7nm node and beyond - New materials and technologies to extend Cu and to enable alternative conductors (invited)
14. Experimental Study of PVD Cu/CVD Co Bilayer Dissolution for BEOL Cu Interconnect Applications
15. Pancreatic neuroendocrine carcinoma with exocrine differentiation in a young cat
16. Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
17. Extendibility of CuMn Alloy-Seed Interconnects and the Fundamentals
18. Erratum: Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects [ECS J. Solid State Sci. Technol.,2, P471 (2013)]
19. Erratum: CVD and ALD Co(W) Films Using Amidinato Precursors as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects [ECS J. Solid State Sci. Technol.,2, P311 (2013)]
20. CVD and ALD Co(W) Films Using Amidinato Precursors as a Single-Layered Barrier/Liner for Next-Generation Cu-Interconnects
21. Self-Assembled Nano-Stuffing Structure in CVD and ALD Co(W) Films as a Single-Layered Barrier/Liner for Future Cu-Interconnects
22. Electrolyte Additive Chemistry and Feature Size-Dependent Impurity Incorporation for Cu Interconnects
23. 638 Analysis of Particle Damping with Hollow Steel Particles
24. Analysis of Particle Damping with Hollow Steel Particles
25. 207305 Damping Effect of Particle Damper Using Metallic Hollow Spheres
26. In-situ observation of electromigration failure in AlCuSi interconnects with a passivation film
27. Self-Assembly Based Air-Gap Integration
28. Reply to comment on ‘Yamada H, Nakamura F, Watanabe Y, Murakami M and Nogami T. 2005. Measuring hydraulic permeability in a streambed using the packer test.Hydrological Processes19: 2507-2524’
29. 3235 A Method for Estimating the Lubrication Performance of Metalworking Fluids
30. Interaction between Additives in Metalworking Fluids under Difficult Cutting Conditions
31. Structural Analysis of the Fundamental Polymer of the Sheath Constructed bySphaerotilus natans
32. ANALYSIS OF STREAM CHANNEL GEOMETRY AND PHYSIOGRAPHIC FORMATIVE PROCESS IN VALLEY FLATS
33. Low-k/Cu Integration Consistent from 90nm thru 32nm (invited)
34. Physical and Chemical Roles of Metalworking Fluids in a Vibration-Assisted Tapping System
35. Micrococcus Blood Stream Infection in Patients Receiving Epoprostenol
36. Measuring hydraulic permeability in a streambed using the packer test
37. QUANTITATIVE CLASSIFICATION OF TOPOGRAPHICAL FEATURES OF STEEP-STREAM RIVERBEDS
38. RESEARCH ON CLASSIFICATION OF HABITAT IN MOUNTAIN RIVERS
39. Research on Fish Habitats in the Makomanai River
40. IMP Ta/Cu seed layer technology for high-aspect-ratio via fill by electroplating, and its application to multilevel single-damascene copper interconnects
41. Cu behaviors induced by aging and their effects on electromigration resistance on Al-Cu lines
42. Electromigration Lifetime as a Function of Line Length or Step Number
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