41 results on '"NAI, S. M. L."'
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2. Selective laser melting enabling the hierarchically heterogeneous microstructure and excellent mechanical properties in an interstitial solute strengthened high entropy alloy
3. Interplay between microstructure and deformation behavior of a laser-welded CoCrFeNi high entropy alloy
4. Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder
5. Enhanced Mechanical Properties of Poly(Vinyl Alcohol) Nanofibers With Molecular Level Dispersed Graphene
6. Influence of Bonding Pressure on the Mechanical Properties of Copper Bumps
7. Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
8. Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
9. Effect of Ni-Coated Carbon Nanotubes on the Creep Behavior of Sn-Ag-Cu Solder by Nanoindentation
10. NANOMECHANICAL PROPERTIES OF A Sn–Ag–Cu SOLDER REINFORCED WITH Ni-COATED CARBON NANOTUBES
11. Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
12. INDENTATION SIZE EFFECT ON THE CREEP BEHAVIOR OF A SnAgCu SOLDER
13. Thermal Management for High Power Light-Emitting Diode Street Lamp
14. Enhancement of Mechanical Properties by Reinforcing Magnesium With Ni-Coated Carbon Nanotubes
15. Effect of Ni-coated carbon nanotubes on the microstructure and properties of a Sn-Ag-Cu solder
16. Integrating copper at the nanometer length scale with Sn–3·5Ag solder to develop high performance nanocomposites
17. Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates
18. Enhancing the properties of a lead-free solder with the addition of Ni-coated carbon nanotubes
19. Advanced high density interconnect materials and techniques
20. DFT Study on Nano Structures of Sn/CNT Complex for Potential Li-Ion Battery Application
21. Using Microwave-Assisted Powder Metallurgy Route and Nano-size Reinforcements to Develop High-Strength Solder Composites
22. A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints
23. Indentation Size Effect on the Hardness of a Sn-Ag-Cu Solder
24. Utilizing energy efficient microwave sintering to significantly enhance the tensile response of a lead-free solder
25. Development of Al and Al/Cu (composite/alloy) formulations with enhanced properties through microwave power variations during hybrid sintering
26. Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders
27. Using carbon nanotubes to enhance creep performance of lead free solder
28. Effect of Nano-Size Oxide Based Reinforcement on the Tensile Properties of Sn-Ag-Cu Solder
29. Development of Lead-Free Nanocomposite Solders Using Oxide Based Reinforcement
30. Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
31. Influence of Reinforcements on the Electrical Resistivity of Novel Sn-Ag-Cu Composite Solder
32. Lead-free solder reinforced with multiwalled carbon nanotubes
33. Effect of Presence of Multi-Walled Carbon Nanotubes on the Creep Properties of Sn-Ag-Cu Solder
34. DEVELOPMENT OF NOVEL LEAD-FREE SOLDER COMPOSITES USING CARBON NANOTUBE REINFORCEMENTS
35. Development of Advanced Lead-Free Solder Based Interconnect Materials Containing Nanosized Y2O3 Particulates
36. Effect of Presence of Carbon Nanotubes on the Wettability and Mechanical Performance of Sn-Ag-Cu Solder
37. Kinetics of interface reaction and intermetallics growth of Sn-3.5Ag-0.7Cu/Au/Ni/Cu system under isothermal aging
38. Low Temperature Wafer Bonding Process Using Sol-Gel Intermediate Layer
39. Synthesis and wear of Al based, free standing functionally gradient materials: effects of different reinforcements
40. Enhancing the Performance of Sn-Ag-Cu Solder With the Addition of Titanium Diboride Particulates
41. Synthesis of Al/SiC based functionally gradient materials using technique of gradient slurry disintegration and deposition: effect of stirring speed
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