15 results on '"Maus, I"'
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2. Metaproteome analysis reveals that syntrophy, competition, and phage-host interaction shape microbial communities in biogas plants
3. Characterization of epoxy based highly filled die attach materials in microelectronics
4. Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization — Difficulties and solution
5. Challenges of viscoelastic characterization of low TG epoxy based adhesives for automotive applications in DMA and relaxation experiments
6. Fracture toughness of Cu–EMC interfaces in pressurized steam
7. Determination of interface fracture parameters: Energy Release Rate and Mode Mixity using FEA
8. Establishing mode mix dependency of fracture toughness in microelectronic components with reduced experimental effort
9. Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
10. Fracture toughness characterization and modeling of interfaces in microelectronic packages - A status review
11. Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation
12. Interfacial fracture toughness measurements in microelectronic packages with different test setups on samples from production
13. Fracture-mechanical interface characterisation for thermo-mechanical co-design — An effcient and comprehensive method for critical mixed-mode data extraction
14. Interface fracture mechanics evaluation by correlation of experiment and simulation
15. Interfacial fracture parameters of silicon-to-molding compound
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