56 results on '"Lo W.-C."'
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2. Republication de : Nasopharyngeal mass resulting in bilateral otitis media with effusion
3. Nasopharyngeal mass resulting in bilateral otitis media with effusion
4. Development of Highly Manufacturable, Reliable, and Energy-Efficient Spin-Orbit Torque Magnetic Random Access Memory (SOT-MRAM)
5. Structural Analysis on the Coil Spring of Motorcycle Suspension System
6. Evaluation of Ultrafast Wave–Controlled Aliasing in Parallel Imaging 3D-FLAIR in the Visualization and Volumetric Estimation of Cerebral White Matter Lesions
7. Electromigration Improvement by Graphene on Cu Wire for Next Generation VLSI
8. Low Power System-on-Chip Platform Architecture for High Performance Applications
9. 3D Scalable, Wake-up Free, and Highly Reliable FRAM Technology with Stress-Engineered HfZrOx
10. Prognostic impact of pre-treatment neutrophil-to-lymphocyte ratio (NLR) in nasopharyngeal carcinoma: A retrospective study of 180 Taiwanese patients
11. A real-time prediction model for post-irradiation malignant cervical lymph nodes
12. Prognostic impact of pre-treatment neutrophil-to-lymphocyte ratio (NLR) in nasopharyngeal carcinoma: A retrospective study of 180 Taiwanese patients
13. The effects of post-deposition ion-beam bombardment with oxygen on the Co surface in modifying the magnetic properties of Co thin films
14. Novel interposer scheme for 3D integration
15. Fully 3-D symmetrical TSV monolithic transformer for RFIC
16. Second haploidentical peripheral blood stem cell transplantation for treatment of acute leukemia with relapse after first allogeneic peripheral blood stem cell transplantation
17. Quality assessment and improvement of nationwide cancer registration system in Taiwan: a review
18. Three-tier chips stack with TSVs for backside illuminated image sensor/ADC/ISP
19. Process integration for backside illuminated image sensor stacked with Analog-to-Digital Conversion chip
20. Dose-dependent effects of d-methionine for rescuing noise-induced permanent threshold shift in guinea-pigs
21. Process integration of backside illuminated image sensor with thin wafer handling technology
22. Powered saline irrigation is useful for endoscopic removal of fungus balls in maxillary sinuses: Our experience in fifty patients
23. Advanced image analysis and finite element modeling for knees with osteoarthritis
24. Intralesional steroid injection: an alternative treatment option for vocal process granuloma in ten patients
25. Thin-Wafer Handling with a Heat-Spreader Wafer for 2.5D/3D IC Integration
26. A simple and feasible process for using multi-stage high-precision DTMs, field surveys and rainfall data to study debris flow occurrence factors of Shenmu area, Taiwan
27. 3D Integration with Wafer-to-Wafer Bonding
28. Electrical performances and quality investigations of integrated bonded structures and TSVs for 3D interconnects
29. Low temperature process evaluation for 3DIC integrated thin wafer handling
30. Electrical characterization of through silicon vias (TSVs) with an on chip bus driver for 3D IC integration
31. Structural design, process, and reliability of a wafer-level 3D integration scheme with Cu TSVs based on micro-bump/adhesive hybrid wafer bonding
32. Electrical characterization and reliability investigations of Cu TSVs with wafer-level Cu/Sn-BCB hybrid bonding
33. Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies
34. Impact of Unbalance Single-phase Traction Load to Three-phase Power System
35. Cu-based bonding technology for 3D integration applications
36. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300 mm Multi-Project Wafer (MPW)
37. P189. Salvage treatment for isolated regional failure of nasopharyngeal carcinoma – Does post-operative radiotherapy have the survival benefit?
38. 284 Efficacy and toxicity of azacitidine 100 mg fixed dose for the treatment and re-treatment of myelodysplastic syndrome and acute myeloid leukemia
39. Process integration and reliability test for 3D chip stacking with thin wafer handling technology
40. Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration
41. Feasibility Study of a 3D IC Integration System-in-Packaging (SiP) from a 300mm Multi-Project Wafer (MPW)
42. Thin Wafer Handling of 300mm Wafer for 3D IC Integration
43. Effect of Impermeable Boundaries on the Propagation of Rayleigh Waves in an Unsaturated Poroelastic Half-Space
44. W36 SIGNIFICANT ASSOCIATION BETWEEN GENETIC POLYMORPHISMS IN VITAMIN K EPOXIDE REDUCTASE GENE AND THE RISK OF ISCHEMIC STROKE
45. Novel Dynamic Threshold Voltage Contact Etching Stop Layer (DT-CESL) Strained HfO2 nMOSFET for Very Low Voltage Operation (0.7V)
46. The Measure of Success: Constraints, Objectives, and Tradeoffs in Morphogen-mediated Patterning
47. Isolated adult Langerhans' cell histiocytosis in cervical lymph nodes: should it be treated?
48. New Observation on PBTI Characteristics of Contact Etching Stop Layer (CESL) Induced Tensile Strained HfO2 nMOSFET
49. Morphology and electrical conduction of Si:P δ-doped layers on vicinal Si(001)
50. Six Sigma approach to improve surface precision of optical lenses in the injection-molding process
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