9 results on '"Kang, Hanbyul"'
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2. PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices
3. Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy
4. Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)
5. Characterization of plate-like Ni-Sn intermetallic compounds in Sn-Ag solder bump
6. Effect of Corrosion on Mechanical Reliability of Sn-Ag Flip-Chip Solder Joint
7. Formation of octahedral corrosion products in Sn–Ag flip chip solder bump
8. Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation
9. Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism
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