16 results on '"Hwang, Byeong-Uk"'
Search Results
2. Microstructural evolution and mechanical properties of SAC305 with the intense pulsed light soldering process under high-temperature storage test
3. Hybrid transient liquid phase sintering bonding of Sn-3.0Ag-0.5Cu solder with added Cu and Ni for Cu Ni bonding
4. Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
5. Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi
6. Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)
7. Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability
8. Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding
9. Bending reliability of Ni–MWCNT composite solder with a differential structure
10. The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature
11. Pressureless transient liquid phase bonding using SAC305 with hybrid Ag particles and its reliability under high-temperature storage test
12. Pressureless transient liquid phase sintering bonding using SAC305 with hybrid Ag particles for high–temperature packaging applications
13. Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish
14. Transient Liquid Phase Sintering of Ni and Sn-58Bi on Microstructures and Mechanical Properties for Ni–Ni Bonding
15. Fabrication of Novel Ag Flake Composite Films Using a CMC/PEI Cross-Linking Process
16. Effect of SDBS on the oxidation reliability of screen-printed Cu circuits
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.