166 results on '"Huang, M. L."'
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2. Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering
3. Fuzzy Selection Model for Quality-Based IC Packaging Process Outsourcers
4. Board-level drop reliability and fracture behavior of low-temperature soldering Sn–Ag–Cu/Sn–Bi–X hybrid BGA solder joints for consumer electronics
5. Ultrasonic-assisted soldering of aluminium and copper with Sn–Zn–Bi–Ag solder
6. In Situ Observation of Electromigration-Induced Anomalous Precipitation of Ag3Sn Phase in Ag-Containing Solder Joints
7. InGaAs, Ge, and GaN Metal-Oxide-Semiconductor Devices with High-k Dielectrics for Science and Technology Beyond Si CMOS
8. Cervical cytomegalovirus reactivation, cytokines and spontaneous preterm birth in Kenyan women
9. Reliability analysis of unsaturated soil slope stability using spatial random field-based Bayesian method
10. A novel Ćuk converter with wide input voltage range
11. Advances on III-V MOSFET for Science and Technology beyond Si CMOS
12. Rapamycin immune tolerization enables gene transfer following subcutaneous delivery of AAV6 but not CD4-retargeted AAV6 vectors in AAV-seropositive rhesus macaques
13. Analysis on Market Mechanism of Demand Response and its Outlook in China
14. Abnormal migration behavior and segregation mechanism of Bi atoms undergoing liquid–solid electromigration
15. Precise tuning of single molecule conductance in an electrochemical environment
16. Complexation Behavior and Co-Electrodeposition Mechanism of Au-Sn Alloy in Highly Stable Non-Cyanide Bath
17. Implementation of Four-Phase Interleaved Balance Charger for Series-Connected Batteries with Power Factor Correction
18. Low Temperature Ni/Sn/Ni Transient Liquid Phase Bonding for High Temperature Packaging Applications by Imposing Temperature Gradient
19. Composition design of Sn-rich Sn–Au–Ag solders using cluster-plus-glue-atom model
20. Comment on “Electric current induced flow of liquid metals: Mechanism and substrate-surface effects” [J. Appl. Phys. 115, 044915 (2014)]
21. Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect
22. Study on the compounds of Mg12La and (Mg,Zn)11.5La
23. Study on Co-Electrodeposition Mechanism of Au-30at.%Sn Eutectic in Non-Cyanide Bath by Electrochemical Methods
24. Abnormal Intermetallic Compound Evolution in Ni/Sn/Ni and Ni/Sn-9Zn/Ni Micro Solder Joints Under Thermomigration
25. Flame retardancy and mechanical properties of poly(decamethylene terephthalamide) filled with metal phosphinates
26. High performance In0.53Ga0.47As FinFETs fabricated on 300 mm Si substrate
27. Novel Growth of Whole Preferred Orientation Intermetallic Compound Interconnects for 3D IC Packaging
28. Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy
29. Human herpesvirus 6B reactivation and delirium are frequent and associated events after cord blood transplantation
30. Effect of Electromigration on the Type of Drop Failure of Sn–3.0Ag–0.5Cu Solder Joints in PBGA Packages
31. In0.53Ga0.47As MOSFETs with high channel mobility and gate stack quality fabricated on 300 mm Si substrate
32. A study of the kinematics of unusually H I-rich galaxies
33. Size effect on tensile properties of Cu/Sn–9Zn/Cu solder interconnects under aging and current stressing
34. Three-dimensional astrocyte-network Ni–P–O compound with superior electrocatalytic activity and stability for methanol oxidation in alkaline environments
35. Natural Epstein-Barr Virus Isolates from Southern China and California Differ in the Bam Hl I Region
36. Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
37. Size effect on interfacial reactions of Sn–3.0Ag–0.5Cu solder balls on Cu and Ni–P pads
38. Enhanced Corrosion Resistance of Co-Sn Alloy Coating with a Self-Organized Layered Structure Electrodeposited from Deep Eutectic Solvent
39. Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7Cu solder
40. Growth of three-dimensional graphene layers using plasma enhanced CVD
41. Influence of rare earth Ce addition on the microstructure, properties and soldering reaction of pure Sn
42. Composition control of co-electroplating Au–Sn deposits using experimental strategies
43. An observational and theoretical view of the radial distribution of H I gas in galaxies
44. Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration
45. Different diffusion behavior of Cu, Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects during liquid-solid electromigration
46. High-k dielectrics on (100) and (110) n-InAs: Physical and electrical characterizations
47. Fixing frataxin: ‘ironing out’ the metabolic defect in Friedreich's ataxia
48. Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates
49. (Invited) Electromigration Reliability of Lead-Free Solder Interconnects
50. A novel high-photoactivity quaternary ZnSn(OH)6–graphene composite evolved from a 3D multilayer structure via a facile and green proton-mediated self-assembly method
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