1. Ti and nitride surface modification of copper by pack cementation
- Author
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Stathokostopoulos, D., Chaliampalias, D., Pliatsikas, N., Kassavetis, S., Pavlidou, E., Patsalas, P., Logothetidis, S., Chrissafis, K., and Vourlias, G.
- Abstract
ABSTRACTCopper is widely applied however its disadvantages such as low hardness and poor oxidation resistance. TiN coatings are often used industrially for overriding such disadvantages of ferrous components. In this examination the deposition of TiN on Cu substrates is investigated for the first time by pack cementation process with which one or more elements can be deposited simultaneously by gas and solid-state diffusion reactions. This feature makes this process very attractive for industrial use as it is economic and time saving. Microstructural examination of the deposited samples revealed the formation of thick coatings corresponding to Ti–Cu phases. Focusing on the coating surface it was found that a TiN thin layer is formed. This was verified also from hardness measurements which showed that there was a significant increase of the surface hardness. Furthermore, the oxidation resistance of the coated samples has considerably increased as implied from the thermogravimetric measurements.
- Published
- 2018
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