1. Wet-Chemically Grown Interfacial Oxide for Passivating Contacts Fabricated With an Industrial Inline Processing System
- Author
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Min, Byungsul, Noack, Philipp, Wattenberg, Bianca, Dippell, Torsten, Schulte-Huxel, Henning, Peibst, Robby, and Brendel, Rolf
- Abstract
This article presents for the first time the application of wet-chemical interfacial oxide from an industrial inline processing system for poly-Si-based passivating contacts. An excellent passivation quality is achieved by creating an interfacial oxide with a very short exposure time of 90 s in ozonized water and by adjusting the annealing temperature in a tube furnace, resulting in surface recombination current densities of 4 fA/cm
2 and 1.2 fA/cm2 before and after a hydrogenation step, respectively. Detailed electrical characterization reveals the interplay of in-diffusion of P into the wafer and hydrogenation step. Our investigation shows that the optimum annealing temperature can differ before and after the hydrogenation step. The developed wet-chemical interfacial oxide is successfully implemented in back junction solar cells on large-area gallium-doped p-type silicon wafers (156.75 × 156.75 mm2 ) featuring a phosphorus-doped poly-Si-based passivating contact at the rear side. The best cell has an efficiency of 23.6% and an open-circuit voltage of 719 mV, independently confirmed by ISFH CalTeC in Germany. Our cost calculation shows a saving of up to 17.2% in capital expenditure, 5.2% p.a. in operating expense, and 9.0% in the footprint if the interfacial oxide is formed by an inline wet-chemical processing system instead of a plasma chamber.- Published
- 2024
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