1. Optimizing Cobalt Silicide Interfaces With Carbon PAI: Enhanced Thermal Stability and Reduced Specific Contact Resistivity for DRAM Applications
- Author
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He, Yanping, Mao, Shujuan, Xu, Jing, Sun, Xianglie, Chen, Xu, Gao, Jianfeng, Liu, Weibing, Liu, Jinbiao, Li, Junfeng, Wang, Guilei, Zhao, Chao, and Luo, Jun
- Abstract
For its future application in 4F
2 dynamic random access memory (DRAM) with vertical transistor architecture, it is critical to enhance the thermal stability as well as to reduce specific contact resistivity ($\rho _{\text {c}}$ 2 /n+ -Si contacts. In this work, the carbon preamorphization implantation (PAI) method to simultaneously decrease the$\rho _{\text {c}}$ 2 is proposed. The electrical property and morphology of the CoSi2 /n+ -Si contact with and without carbon PAI are systematically investigated. Compared to the reference without carbon, the samples with carbon PAI achieve a 68.2% reduction in$\rho _{\text {c}}$ ${R}_{\text {s}}$ 2 after high-temperature annealing at$950~^{\circ }$ $+ 750~^{\circ }$ $\rho _{\text {c}}$ 2 , providing valuable insights for advancing DRAM technology.- Published
- 2024
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