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In this work, thermal hysteresis of PCM inside different encapsulated configurations (circle, triangle and square) during melting and solidification processes are investigated numerically. Charging and discharging of a latent heat storage during unsteady complex phenomena was simulated numerically using the finite element method. The results indicate that the time elapsed was minimum for triangular encapsulated configuration and maximum time for circular encapsulated configuration for both the melting and solidification process. The time of thermal hysteresis of the melting and solidification process decreased with the increasing Rayleigh number for all encapsulated configurations. Circular encapsulated configuration has higher latent heat storage than triangular and square encapsulated configurations, while circular encapsulated configuration has a minimum.