1. The Tuning Capability of CuO and Na2CO3 Dopant on Physical Properties for Laser Sealing Using Fiber Types of Sealant
- Author
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So Young Kim, Jin Hyeok Kim, Jong Hyeob Baek, Ju Hyeon Choi, June Park, Seon Hoon Kim, and Linganna Kadathala
- Subjects
Materials science ,Glass fiber ,lead silicate glass ,02 engineering and technology ,Substrate (electronics) ,01 natural sciences ,lcsh:Technology ,Thermal expansion ,law.invention ,lcsh:Chemistry ,law ,0103 physical sciences ,General Materials Science ,glass transition temperature ,Fiber ,Composite material ,Instrumentation ,lcsh:QH301-705.5 ,010302 applied physics ,Fluid Flow and Transfer Processes ,Dopant ,lcsh:T ,Process Chemistry and Technology ,General Engineering ,021001 nanoscience & nanotechnology ,Tin oxide ,Laser ,lcsh:QC1-999 ,Computer Science Applications ,lcsh:Biology (General) ,lcsh:QD1-999 ,lcsh:TA1-2040 ,0210 nano-technology ,Glass transition ,coefficient of thermal expansion ,lcsh:Engineering (General). Civil engineering (General) ,glass fiber ,laser sealing ,lcsh:Physics - Abstract
PbO-SiO2-Al2O3-B2O3 (PSAB)-based glasses were prepared in order to determine the feasibility for laser sealing in the form of fiber. To reach a high quality of laser sealing, the tuning capability of CuO and Na2CO3 dopant concentration was examined on thermal, thermo-mechanical, and optical properties of glasses. The difference of thermal expansion coefficient was reduced with codoping of 1 wt% CuO-2 wt% Na2CO3 into the PSAB glass system, and it amounted to 0.34 ×, 10&minus, 6/K. The codoped PSAB glass system reached 100% absorption at 810 nm, which corresponds to the wavelength of laser. The glass fiber with a diameter of 180 &mu, m was successfully pulled from the codoped PSAB glass system. The fluorine-doped tin oxide (FTO) glass substrate using the glass fiber was successfully sealed. It presented a crack-free sealed surface with a sealing strength of about 41 MPa. These results indicate that the PSAB-based glass system in the form of fiber is proved as a laser sealing material in packaging systems.
- Published
- 2020