1. Evaluation of the Effect of Surface Structure on Flexibility of Si Wafers for Flexible c-Si Solar Cells
- Author
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Ide, K., Hara, Y., Nishihara, T., Yokogawa, R., Nakamura, K., Ohshita, Y., Kawatsu, T., Nagai, T., Yamada, N., Miyashita, Y., Aoki, Y., Kobayashi, H., and Ogura, A.
- Subjects
Feedstock, Crystallisation, Wafering, Defect Engineering ,Silicon Materials and Cells - Abstract
8th World Conference on Photovoltaic Energy Conversion; 149-152, The Ball-on-Ring test, a type of biaxial bending test that can evaluate the three dimensions flexibility using the maximum bending deflection at crystalline Si wafer fracture. The wafer flexibility was improved by slice damage removal etching process, significantly. And texture formation on the wafer surface decreased flexibility. Furthermore, we found that the flexibility was recovered by mixed acid etching. However, the recovery was not completed as good as before the texturing. SEM observation of the area near the fracture starting point of these samples showed that fracture proceeded along the valley of the pyramidal structure. Further magnification showed that the valleys were rounded off by mixed acid etching. The rounded valleys of the textured structure, mitigated the fracture. Meanwhile reflectance measurements showed that the mixed acid etching had no significant effect on reflectance.
- Published
- 2022
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