1. Integration with Light
- Subjects
Flexible electronics ,Infrared devices ,Conductive adhesive ,LIFT ,Tin alloys ,Plastic bottles ,Substrates ,Electric lamps ,SAC-solders ,Temperature ,Laser printing ,Low temperature bonding ,Soldering ,NIR curing ,Lead-free solders ,Light emitting diodes ,Flip chip devices ,Copper alloys ,Silver alloys ,Adhesives ,Light absorption ,Surface mount technology ,Flip chip bonding ,Photonic soldering ,Low temperature operations - Abstract
This paper reports the use of Laser-induced Forward Transfer (LIFT) technology for printing of multilayer flexible circuitries and the fabrication of micro-bumps for flip-chip bonding of packaged LEDs and bare die microcomponents. Bonding of passive and functional surface mount devices (SMD) on low-temperature polyethylene terephthalate (PET) foils have been demonstrated using two selective bonding techniques. Firstly, using a high intensity near-infrared (NIR) lamp, a bare die NFC chip was bonded on micro-bumps formed with LIFT printed isotropic conductive adhesive (ICA) within less than a minute. Secondly, using a high intensity Xenon lamp, passive components and packaged LEDs were bonded within 5 seconds on microbumps formed with conventional Sn-Ag-Cu (SAC) lead-free alloys. In the both cases, due to selective light absorption, a limited temperature increase was observed in the PET substrates allowing successful bonding of components onto the delicate polyethylene foil substrates using conventional interconnect materials. © 2018 IEEE.
- Published
- 2018