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Application prospects in automotive and aerospace industry have led to extensive studies on AA6xxx alloys in recent years. Varying amounts of Mg, Si and Cu and heat treatments are used to achieve the desired mechanical properties in these alloys. In this investigation, a series of tests have been designed and carried out on model AlMgSi(Cu) alloys to investigate the effects of Cu, Mg and Si composition and heat treatments on the corrosion properties for a range of Cu content levels (0.03, 0.15 and 0.80 wt%, respectively). The results indicate that the localized corrosion susceptibility of the model alloys primarily increased with Cu content. The Si and Mg content and ratio do not appear to have a significant effect on the local corrosion behaviour. Heat treatment can improve the corrosion resistance. However, this effect is small compared to that of the Cu content for the range of model alloys investigated. Intergranular corrosion will occur by micro-galvanic coupling between the cathodic AlMgSi(Cu) (Q) phaseprecipitates and the aluminum matrix adjacent to the particles. The increasing susceptibility to intergranular corrosion with Cu content can be attributed to an increased formation of Q phase particles.

The invention relates to an organic electronic device, comprising a layered stack with an opaque substrate, a current collector layer on top of the substrate, a electron transport layer, a hole transport layer, and a photoactive layer between the electron transport layer and the hole transport layer, wherein a current collector structure is provided on top of the layered stack, and wherein the opaque substrate is a metallic substrate. In addition, the invention relates to a method for manufacturing an organic electronic device, the method comprising applying a current collector structure having an adjacent layer comprising a high conductivity polymer material with a conductivity of 104 - 105 S/m, wherein the adjacent layer is applied by providing the high conductivity polymer material on a stamp material; pressing the stamp material on a receiving surface with the high conductivity polymer material facing the receiving surface such that the high conductivity polymer material and the receiving surface are in contact, and peeling off the stamp material such that the high conductivity polymer material is transferred to the receiving surface.