T. S. Lopes, J. P. Teixeira, M. A. Curado, B. R. Ferreira, A. J. N. Oliveira, J. M. V. Cunha, M. Monteiro, A. Violas, J. R. S. Barbosa, P. C. Sousa, I. Çaha, J. Borme, K. Oliveira, J. Ring, W. C. Chen, Y. Zhou, K. Takei, E. Niemi, F. L. Deepak, M. Edoff, G. Brammertz, P. A. Fernandes, B. Vermang, P. M. P. Salomé, Repositório Científico do Instituto Politécnico do Porto, LOPES, Tomas, Teixeira, JP, Curado, M, Ferreira, BR, Oliveira, AJN, Cunha, JMV, Monteiro, M, Violas, A, Barbosa, JRS, Sousa, PC, Caha, I, Borme, J, Oliveira, K, Ring, J, Chen, WC, Zhou, Y, Takei, K, Niemi, E, Deepak, FL, Edoff, M, BRAMMERTZ, Guy, Fernandes, PA, VERMANG, Bart, and Salome, PMP
For the first time, the incorporation of interface passivation structures in ultrathin Cu(In,Ga)Se2 (CIGS) based solar cells is shown in a flexible lightweight stainless-steel substrate. The fabrication was based on an industry scalable lithography technique - nanoimprint lithography (NIL) - for a 15x15 cm2 dielectric layer patterning, needed to reduce optoelectronic losses at the rear interface. The nanopatterning schemes are usually developed by lithographic techniques or by processes with limited scalability and reproducibility (nanoparticle lift-off, spin-coating, etc). However, in this work the dielectric layer is patterned using NIL, a low cost, large area, high resolution, and high throughput technique. To assess the NIL performance, devices with a NIL nanopatterned dielectric layer are benchmarked against electron-beam lithography (EBL) patterning, using rigid substrates. Up to now, EBL is considered the most reliable technique for patterning laboratory samples. The device patterned by NIL shows similar light to power conversion efficiency average values compared to the EBL patterned device - 12.6 % vs 12.3 %, respectively - highlighting the NIL potential for application in the solar cell sector. Moreover, the impact of the lithographic processes, such as different etch by-products, in the rigid solar cells’ figures of merit were evaluated from an elemental point of view via X-ray Photoelectron Spectroscopy and electrically through a Solar Cell Capacitance Simulator (SCAPS) fitting procedure. After an optimised NIL process, the device on stainless-steel achieved an average power conversion efficiency value of 11.7 % - a slightly lower value than the one obtained for the rigid approach, due to additional challenges raised by processing and handling steel substrates, even though scanning transmission electron microscopy did not show any clear evidence of impurity diffusion towards the absorber. Notwithstanding, time-resolved photoluminescence results strongly suggested the presence of additional non-radiative recombination mechanisms in the stainless-steel absorber, which were not detected in the rigid solar cells, and are compatible with elemental diffusion from the substrate. Nevertheless, bending tests on the stainless-steel device demonstrated the mechanical stability of the CIGS-based device up to 500 bending cycles., This work was funded in part by the Fundação para a Ciência e a Tecnologia (FCT) under Grants 2020.04564.BD, IF/00133/2015, PD/BD/142780/2018, SFRH/BD/146776/2019, UIDB/04564/2020 and UIDP/04564/2020, 2020.07073.BD, as well as through the projects NovaCell (PTDC/CTMCTM/28075/2017), CASOLEM (028917) “Correlated Analysis of Inorganic Solar Cells in and outside an Electron Microscope”, and InovSolarCells (PTDC/FISMAC/29696/2017) co-funded by FCT and the ERDF through COMPETE2020. And by the European Union's Horizon 2020 research and innovation 15 programme under the grants agreements N°. 720887 (ARCIGS-M project) and grand agreement N°.715027 (Uniting PV). The Special Research Fund (BOF) of Hasselt University is also acknowledged. P. Salomé and P. A. Fernandes would like to acknowledge FCT for the support of the project FCT UIDB/04730/2020. This work was developed within the scope of the project i3N, UIDB/50025/2020 & UIDP/50025/2020, financed by national funds through the FCT/MEC. The authors also acknowledge the support of Carlos Calaza in the fabrication for the 200 mm Si point contact stamp.