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Thermal analysis provides deeper insights into electronic chips behavior under different temperature scenarios and enables faster design exploration. However, obtaining detailed and accurate thermal profile on chip is very time-consuming using FEM or CFD. Therefore, there is an urgent need for speeding up the on-chip thermal solution to address various system scenarios. In this paper, we propose a thermal machine-learning (ML) solver to speed-up thermal simulations of chips. The thermal ML-Solver is an extension of the recent novel approach, CoAEMLSim (Composable Autoencoder Machine Learning Simulator) with modifications to the solution algorithm to handle constant and distributed HTC. The proposed method is validated against commercial solvers, such as Ansys MAPDL, as well as a latest ML baseline, UNet, under different scenarios to demonstrate its enhanced accuracy, scalability, and generalizability.

Numerical simulations for engineering applications solve partial differential equations (PDE) to model various physical processes. Traditional PDE solvers are very accurate but computationally costly. On the other hand, Machine Learning (ML) methods offer a significant computational speedup but face challenges with accuracy and generalization to different PDE conditions, such as geometry, boundary conditions, initial conditions and PDE source terms. In this work, we propose a novel ML-based approach, CoAE-MLSim (Composable AutoEncoder Machine Learning Simulation), which is an unsupervised, lower-dimensional, local method, that is motivated from key ideas used in commercial PDE solvers. This allows our approach to learn better with relatively fewer samples of PDE solutions. The proposed ML-approach is compared against commercial solvers for better benchmarks as well as latest ML-approaches for solving PDEs. It is tested for a variety of complex engineering cases to demonstrate its computational speed, accuracy, scalability, and generalization across different PDE conditions. The results show that our approach captures physics accurately across all metrics of comparison (including measures such as results on section cuts and lines).