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Morphologically diverse copper phthalocyanine (CuPc) thin layers were thermally characterized by scanning thermal microscopy (SThM). The organic layers with thicknesses below 1 µm were deposited by physical vapor deposition in a high vacuum on the N-BK 7 glass substrates. Four set of samples were fabricated and studied. Atomic Force Microscopy imaging revealed strong differences in the surface roughness, mean grain size/height, as well as distances between grains for the CuPc layers. For quantitative thermal investigations, three active SThM operating modes were applied using either a Wollaston thermal probe (ThP) or KNT ThP as thermal probe heated with a DC, an AC (3ω-SThM) current or their combination (DC/AC SThM). Meanwhile, qualitative analysis was performed by thermal surface imaging. The results of this study revealed a correlation between the morphology and the local thermophysical properties of the examined CuPc thin layers. It was found that the heat transport properties in such layers will deteriorate with the increase of the surface roughness and porosity. Those results can be a valuable contribution to the further development of phthalocyanine-based devices., (Copyright © 2021. Published by Elsevier B.V.)

High-density polyethylene (HDPE)-based hybrid nanocomposites containing graphene nanoplatelets (GnPs) and multiwall carbon nanotubes (MWCNTs) were fabricated using melt mixing followed by compression molding. The influences of size and weight ratio of both carbon-based nanofillers on the electrical, thermal, and mechanical properties of hybrid nanocomposites were evaluated. This study proves that the size and weight ratio of carbon-based nanofillers play a critical role in determining these properties. The optimum size and weight ratio of GnPs and MWCNTs are determined at the maximum achieved enhancement for each property. The HDPE-based nanocomposites containing GnPs with larger surface area and MWCNTs with higher aspect ratio display the highest electrical conductivity at GnPs/MWCNTs weight ratio of 2/3. The combination of GnPs with larger surface area and MWCNTs with lower aspect ratio provides the maximum Young's modulus enhancement of hybrid nanocomposites at 1/4 weight ratio of GnPs and MWCNTs. The nanocomposite containing GnPs with the largest lateral size and MWCNTs with a higher aspect ratio at a 3/2 weight ratio exhibits the highest thermal conductivity. Also, at around the percolation threshold of GnPs, the incorporation of MWCNTs with larger aspect ratio into the HDPE-based nanocomposites containing GnPs with the largest lateral size shows a distinct synergic effect on the thermal conductivity and Young's modulus, while an additive effect on the electrical conductivity and thermal stability., (© 2021 IOP Publishing Ltd.)

High-density polyethylene (HDPE)-based nanocomposites incorporating three different types of graphene nanoplatelets (GnPs) were fabricated to investigate the size effects of GnPs in terms of both lateral size and thickness on the morphological, thermal, electrical, and mechanical properties. The results show that the inclusion of GnPs enhance the thermal, electrical, and mechanical properties of HDPE-based nanocomposites regardless of GnP size. Nevertheless, the most significant enhancement of the thermal and electrical conductivities and the lowest electrical percolation threshold were achieved with GnPs of a larger lateral size. This could have been attributed to the fact that the GnPs of larger lateral size exhibited a better dispersion in HDPE and formed conductive pathways easily observable in scanning electron microscope (SEM) images. Our results show that the lateral size of GnPs was a more regulating factor for the above-mentioned nanocomposite properties compared to their thickness. For a given lateral size, thinner GnPs showed significantly higher electrical conductivity and a lower percolation threshold than thicker ones. On the other hand, in terms of thermal conductivity, a remarkable amount of enhancement was observed only above a certain filler concentration. The results demonstrate that GnPs with smaller lateral size and larger thickness lead to lower enhancement of the samples' mechanical properties due to poorer dispersion compared to the others. In addition, the size of the GnPs had no considerable effect on the melting and crystallization properties of the HDPE/GnP nanocomposites., (Copyright © 2020, Evgin et al.; licensee Beilstein-Institut.)

Hysteresis loops exhibited by the thermophysical properties of VO 2 thin films deposited on either a sapphire or silicon substrate have been experimentally measured using a high frequency photothermal radiometry technique. This is achieved by directly measuring the thermal diffusivity and thermal effusivity of the VO 2 films during their heating and cooling across their phase transitions, along with the film-substrate interface thermal boundary resistance. These thermal properties are then used to determine the thermal conductivity and volumetric heat capacity of the VO 2 films. A 2.5 enhancement of the VO 2 thermal conductivity is observed during the heating process, while its volumetric heat capacity does not show major changes. This sizeable thermal conductivity variation is used to model the operation of a conductive thermal diode, which exhibits a rectification factor about 30% for small temperature differences (≈70 °C) on its terminals. The obtained results grasp thus new insights on the control of heat currents.

This work presents a direct measurement of the Kapitza thermal boundary resistance R th , between platinum-silicon and platinum silicide-silicon interfaces. Experimental measurements were made using a frequency domain photothermal radiometry set up at room temperature. The studied samples consist of ≈50 nm of platinum and ≈110 nm of platinum silicide on silicon substrates with different doping levels. The substrate thermal diffusivity was found via a hybrid frequency/spatial domain thermoreflectance set up. The films and the interfaces between the two layers were characterized using scanning electron microscopy, transmission electron microscopy and energy-dispersive X-ray spectroscopy. X-ray diffraction was also used to determine the atomic and molecular structures of the samples. The results display an effect of the annealing process on the Kapitza resistance and on the thermal diffusivities of the coatings, related to material and interface changes. The influence of the substrate doping levels on the Kapitza resistance is studied to check the correlation between the Schottky barrier and the interfacial heat conduction. It is suggested that the presence of charge carriers in silicon may create new channels for heat conduction at the interface, with an efficiency depending on the difference between the metal's and substrate's work functions.

The manipulation of mechanical and thermal interfaces is essential for the design of modern composites. Amongst these are copper carbon composites which can exhibit excellent heat conductivities if the Cu/C interface is affected by a suitable interlayer to minimize the Thermal Contact Resistance (TCR) and to maximize the adhesion strength between Cu and C.In this paper we report on the effect of boron based interlayers on wetting, mechanical adhesion and on the TCR of Cu coatings deposited on glassy carbon substrates by magnetron sputtering. The interlayers were 5 nm thick and consisted of pure B and B with additions of the carbide forming metals Mo, Ti and Cr in the range of 5 at.% relative to B. The interlayers were deposited by RF magnetron sputtering from either a pure B target or from a composite target. The interlayer composition was checked by Auger Electron Spectroscopy and found to be homogenous within the whole film.The system C-substrate/interlayer/Cu coating was characterized in as deposited samples and samples heat treated for 30 min at 800 °C under High Vacuum (HV), which mimics typical hot pressing parameters during composite formation. Material transport during heat treatment was investigated by Secondary Ion Mass Spectroscopy (SIMS). The de-wetting and hole formation in the Cu coating upon heat treatment were studied by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM). The adhesion of the Cu coating was evaluated by mechanical pull-off testing. The TCR was assessed by infrared photothermal radiometry (PTR). A correlation between the adhesion strength and the value of the TCR which was measured by PTR was determined for as deposited as well as for heat treated samples.