1. Metal-support interactions in Cu/SiO2 model catalysts
- Author
-
Oetelaar, L.C.A van den, Partridge, A., Toussaint, S.L.G., Flipse, C.F.J., and Brongersma, H.H.
- Subjects
Catalysts -- Research ,Copper -- Research ,Particles -- Research ,Silicon -- Research ,Silicides -- Research ,Chemicals, plastics and rubber industries - Abstract
A study was conducted to analyze the thermal stability of wet-chemically prepared Cu/SiO2 model catalysts supporting nanometer-sized copper particles on silica framework supports. Si(100) wafers were utilized to support the deposited particles. High surface area supports were then used to prevent the sintering of particles. Results indicated that heating in ultrahigh vacuum promoted the interdiffusion of copper through the SiO2 layer into the silicon substrate for thin SIO2 supports and in copper silicide formation for thick SiO2 supports.
- Published
- 1998