1. Designs of low stress I/O pin attach structures
- Author
-
Shih, D. Y., Palmateer, P., Fu, Y., Kapur, S., Arnold, A., Brofman, P., Ghosal, B., Waldman, D., Hayunga, P., Pasco, R., Cvikevich, S., Corso, J., and Advocate, G.
- Subjects
Thin films, Multilayered -- Design and construction ,Microelectronic packaging -- Research ,Business ,Engineering and manufacturing industries ,Science and technology - Abstract
The development of low stress input/output (I/O) pin attachment structures for glass-ceramic modules in mainframe computers is discussed. The use of these I/O pin structures in conjunction with stress reducing soft metal cushion layer can reduce the stress of the pin joint and brazing alloy significantly and protect the glass-ceramic substrate from fractures. Low modulus and low yield strength solder could also contribute to the production of low stress pin joint.
- Published
- 1992