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Epitaxial nanotwinned Cu films with an average two spacing have displayed a high rate of strength-to-electrical resistivity. The studies have shown that in twinned Cu, the ratio has increased continuously with decreasing twin spacing down to a few nanometers and hence nanoscale growth twins can be used for achieving a higher strength-to-resistivity ratio than higher-angle grain boundaries.

The evolution of microstructure and mechanical properties of sputter-deposited Al/Nb multilayers with miscible fcc/bcc type interface and individual layer thickness (h), subjected to helium ion irradiations, is examined. The dependence of radiation hardening on h is inferred by using a composite model considering the formation of the hard [Nb.sub.3]Al intermetallic layer.

The high-vacuum annealing technique is employed to study the thermal stability of the sputter-deposited Cu thin films with a high density of nanoscale growth twins. The nanotwins are shown to exhibit excellent thermal stability, hence imparting hardness to the films.