1. High temperature resistant aging stability of lead-free solder joints by TLP bonding
- Author
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LI Zheng-bing, WANG De, HU De-an, CHEN Yi-ping, CHENG Dong-hai, GUO Yi-le, HE Kai, HUANG Shuo, and LI Xiao-jun
- Subjects
snagcu composite solder ,reflow welding ,transient liquid phase bonding ,ag particle ,Materials of engineering and construction. Mechanics of materials ,TA401-492 - Abstract
The Sn4.7Ag1.7Cu+Ag composite solder/Cu joint was prepared with Sn4.7Ag1.7Cu+Ag composite solder by transient liquid phase (TLP) bonding process.The microstructure of the joints under constant temperature aging was observed by SEM, combined with EDS, the microstructure and properties of the joints under different processes were compared and analyzed. The results show that the service performance of Sn4.7Ag1.7Cu+Ag/Cu joint at high temperature (300℃) is improved with the increase of Ag particle content. When the content of Ag is 25% (mass fraction), the joint does not break after 15 days of service at 83℃ higher than the melting point (217℃) of the base solder, and the tensile strength is 25.74 MPa, which achieves the purpose of low-temperature welding and high-temperature service. Comparing with Sn4.7Ag1.7Cu/Cu joints under reflow welding, with the aging process, the residual Ag particles in Sn4.7Ag1.7Cu+Ag composite solder/Cu joint are dissolved and a large number of Ag3Sn compounds are produced near the interface of the joint. A large number of bulk Ag3Sn compounds can effectively inhibit the diffusion of Sn into the Cu substrate and achieve the purpose of inhibiting the growth of the Cu3Sn layer.Under the condition of service temperature of 200℃, with the aging process, the mechanical properties of the Sn4.7Ag1.7Cu+Ag composite solder/Cu joint first decrease and then increase, then decrease to a stable state, and its mechanical properties are better than that of the Sn4.7Ag1.7Cu/Cu joint.
- Published
- 2021
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