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92 results on '"reflow"'

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1. A smart handheld magnifier for reflowing printed text notices in public spaces.

2. Approaches to nanosolder reflow at the nanoscale.

3. The Effect of Multiple Solder Reflows on the Formation of Cu 6 Sn 5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components.

4. Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test.

5. Simulation of Mechanical Stresses in BaTiO 3 Multilayer Ceramic Capacitors during Desoldering in the Rework of Electronic Assemblies Using a Framework of Computational Fluid Dynamics and Thermomechanical Models.

6. Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process.

7. Influence of Pulsed Laser Mode on Ablation and Modification Processes of SI3N4–TiC Ceramics Surface Layer.

8. Development of Reflow Fill of CGeSbTe Films for Sub‐20 nm Cells in 3D Cross‐Point Memory.

9. An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model.

10. Bonding of 5 μ m Cu-Sn Micro Bumps Using Thermal Reflow and Solid-State Pre-Bonding.

11. Evaluation of the Hardness and Wear Resistance of Alloyed Coatings From Fastening CuSn/CrxCy Mixture Hardened by Plasma and Laser.

12. Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity.

13. Metallographic Studies into the Structure and Physicomechanical Properties of Coatings Obtained Using Plasma Methods.

14. 软熔工艺对低锡量镀锡板耐蚀性的影响.

15. Effect of different thermocouple constructions on heat-level vapour phase soldering profiles.

16. Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres.

17. The Effect of Thermal Ageing on Solder/Substrate Interfacial Microstructures During Reflow of Sn–37Pb and Sn–3Ag–0.5Cu.

18. STUDY OF Co/Sn MULTILAYER SYSTEM WITH VARIOUS TIN LAYER THICKNESS AND REFLOW TEMPERATURES.

19. Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications.

20. Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows.

21. Real-time profiling of reflow process in VPS chamber.

22. Fabrication and shear strength analysis of Sn-3.5Ag/Cu-filled TSV for 3D microelectronic packaging.

23. The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies.

24. The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering.

25. Moisture diffusion and integrated stress analysis in LED module.

26. Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages.

27. New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels.

28. Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices.

29. Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices.

30. Starvation and Reflow of Point Contact Lubricated with Greases of Different Chemical Formulation.

31. Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints.

32. Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn-3.8Ag-0.7Cu solder and copper substrate.

33. THE EFFECT OF REFLOW ON WETTABILITY OF Sn 96.5 Ag 3 Cu 0.5 SOLDER.

34. Domed and Released Thin-Film Construct—An Approach for Material Characterization and Compliant Interconnects.

35. In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders.

36. Integrated MEMS-Tunable VCSELs Using a Self-Aligned Reflow Process.

37. Impact of Organic Substrate Warp on C4 Non-Wets.

38. Modeling of plated through hole reliability and performance.

39. A Study of Difference in Reflow Characteristics Between Electroplated and Sputtered Cu in a Dual-Damascene Fabrication Process for Silicon Semiconductor Devices.

40. Early Interfacial Reaction and Formation of Intermetallic Compounds in the Sn-3.5Ag/Cu Soldering System.

41. Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation.

42. Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation.

43. Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates.

44. Lead-Free Bumping Using an Alternating Electromagnetic Field.

45. A Study on the Thermal Reliability of Cu/SnAg Double-Bump Flip-Chip Assemblies on Organic Substrates.

46. Study of micro-lens array by reflow process.

47. Fabrication and Microstructures of Sequentially Electroplated Sn-Rich Au-Sn Alloy Solders.

48. Effect of 0.5 wt% Cu in Sn-3.5%Ag Solder to Retard Interfacial Reactions With the Electroless Ni-P Metallization for BGA Solder Joints Application.

49. Effect of Oxidation on Indium Solderability.

50. Replication of Microlens Arrays by Gas-Assisted Hot Embossing.

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