1. Submicron three-dimensional trenched electrodes and capacitors for DRAMs and FRAMs: Fabrication and electrical testing.
- Author
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Miyake, M., Scott, J. F., Lou, X. J., Morrison, F. D., Nonaka, T., Motoyama, S., Tatsuta, T., and Tsuji, O.
- Subjects
ELECTRODES ,CAPACITORS ,DYNAMIC random access memory ,BREAKDOWN voltage ,THIN films ,NANOTUBES ,RANDOM access memory - Abstract
We report conformal deposition of both RuO
2 electrodes and PbZrx Ti1-x O3 (PZT) capacitors in submicron Si trenches through the same in situ liquid source mist processing. The step coverage for the RuO2 electrodes is 75% at 225 °C. After electroding, we deposited Pb(Zr,Ti)O3 thin films and nanotubes using the same apparatus with remanent polarization of ∼15 μC/cm2 . The step coverage was 59% on the sidewall and 79% on the bottom wall. Electrical testing showed charge storage (capacitance/trench) was 13±2 pF, with a breakdown voltage of 11.3±0.2 V and dielectric constant [variant_greek_epsilon]=166±30. This shows that a single inexpensive processing can produce fully electroded dynamic random access memory trenched capacitors with high aspect ratios and commercial electrical performance. [ABSTRACT FROM AUTHOR]- Published
- 2008
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