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An 8–18 GHz receiver implemented in silicon-germanium (SiGe) BiCMOS technology is presented. The receiver is designed to enable built-in test (BIT) and consists of a low noise amplifier (LNA), an image-reject mixer, on-chip, automatic gain control (AGC), ring oscillator (RO) sources (used to provide test signals of a predefined amplitude), and digital-to-analog converters (DACs), used for DC bias control of the blocks. The voltage and current biases of both the LNA and the mixer circuit blocks are used as tuning knobs for radio frequency (RF) performance metrics to mitigate the negative effects of total ionizing dose (TID) radiation damage present in extreme environments such as space. Samples of the receiver die were exposed to 10 keV X-rays at 1, 3, and 6 Mrad(SiO_2) doses. The BIT system was able to mitigate for TID damage in most cases, with improvements in the key RF metrics of gain, output third-order intercept point (OIP3), and noise figure (NF). The receiver was fabricated in an 0.18~\mu\m SiGe BiCMOS process technology with a peak f_T of 150 GHz and nominally consumes 241–243 mA from a 4~\V supply. [ABSTRACT FROM PUBLISHER]

A wideband (8–18 GHz) built-in test receiver in silicon–germanium technology is presented. The receiver chain consists of a low-noise amplifier (LNA), an image-reject mixer, on-chip automatic gain control ring oscillator sources that are used to provide test signals of a predefined amplitude, and control circuitry in the form of digital-to-analog converters and data registers. Both the LNA and the mixer circuit blocks incorporate tuning knobs to enable tuning of RF metrics to ensure consistent performance and mitigate the negative effects of process, voltage, and temperature variations, aging, and damage from extreme environments such as ionizing radiation. A maximum post-healed gain greater than 30 dB, an image rejection ratio exceeding 30 dB, output third-order intercept point greater than 8 dBm, and noise figure less than 9 dB are obtained in measurement. An automated healing algorithm was developed and shown to be effective at improving the overall performance of the receiver. The receiver was fabricated in an 0.18-\mum SiGe BiCMOS process with a peak f_T of 150 GHz, and consumes 240–260 mA from a 4-V supply. [ABSTRACT FROM AUTHOR]

We present a wideband, low noise amplifier (LNA) implemented in a Silicon-Germanium Heterojunction Bipolar Transistor (SiGe HBT) technology. This SiGe LNA covers a frequency range of 8–16 GHz and achieves a peak gain of 17.5 dB at nominal bias and a peak OIP3 of 15.8 dBm at 10 GHz at nominal bias. The noise figure (NF) of the LNA is 4.5–8.1 dB across band, and it nominally consumes 4 mA from a 4 V supply. Samples were irradiated with 63.3 MeV protons to proton-equivalent doses ranging from 200 krad(Si) to 2 Mrad(Si). This LNA incorporates bias control “tuning-knobs” to enable bias tuning to mitigate for RF performance loss due to total dose exposure and process variation in performance metrics. The effectiveness of the tuning “knobs” to compensate for lost post-irradiated performance was investigated. It was found that the LNA performance can be restored with the use of the tuning knobs with a performance tuning algorithm. [ABSTRACT FROM AUTHOR]

A wideband (6–20 GHz) Silicon-Germanium (SiGe) adaptive image-reject mixer with an intermediate frequency (IF) of 1.8 GHz is presented. The mixer can be “self-healed” to deliver consistent performance by nullifying the effects of process variations, environmental changes, or aging. Various performance metrics of the mixer can also be adapted to different specifications across multiple frequency bands. A conversion gain greater than 15 dB, an image rejection ratio (IRR) exceeding 35 dB, and an output 1-dB compression point greater than 10 dBm, were obtained in measurement. An automated self-healing procedure is developed and shown to be effective for improving the measured performance of the mixer. The mixer was fabricated in a 150 GHz peak fT, 200 nm SiGe BiCMOS process technology and consumes 215 mA of current operating off a 4 V rail. [ABSTRACT FROM AUTHOR]

Abstract-We investigate the single-event transient (SET) response of bandgap voltage references (BGRs) implemented in SiGe BiCMOS technology through heavy ion microbeam experiments. The SiGe BGR circuit is used to provide the input reference voltage to a voltage regulator. SiGe HBTs in the BGR circuit are struck with 36-MeV oxygen ions, and the subsequent transient responses are captured at the output of the regulator. Sensitive devices responsible for generating transients with large peak magnitudes (more than 5% of the dc output voltage) are identified. To determine the effectiveness of a transistor-layout-based radiation hardened by design (RHBD) technique with respect to immunity to SETs at the circuit level, the BGR circuit implemented with HETs surrounded by an alternate reverse-biased pn junction (n-ring RHBD) is also bombarded with oxygen ions, and subsequent SETs are captured. Experimental results indicate that the number of events causing transients with peak magnitude more than 5% above the dc level have been reduced in the RHBD version; however, with the inclusion of the n-ring RHBD, new locations for the occurrence of transients (albeit with smaller peak magnitude) are created. Transients at the transistor-level are also independently captured and are presented. It is demonstrated that while the transients are short at the transistor level (ns duration), relatively long transients are obtained at the circuit level (hundreds of nanoseconds). In addition, the impact of the SET response of the BGR on the performance of an ultra-high-speed 3-bit SiGe analog-to-digital converter (ADC) is investigated through simulation. It is shown that ion-induced transients in the reference voltage could eventually lead to data corruption at the output of the ADC. [ABSTRACT FROM AUTHOR]