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We present the first steps of a device suitable for characterization of complex 3D micro-structures. This method is based on an optical approach allowing extraction and separation of high frequency ultrasonic sound waves induced to the analyzed samples. Rapid, non-destructive characterization of 3D micro-structures are limited in terms of geometrical features and optical properties of the sample. We suggest a method which is based on temporal tracking of secondary speckle patterns generated when illuminating a sample with a laser probe while applying known periodic vibration using an ultrasound transmitter. In this paper we investigated lasers drilled through glass vias. The large aspect ratios of the vias possess a challenge for traditional microscopy techniques in analyzing depth and taper profiles of the vias. The correlation of the amplitude vibrations to the vias depths is experimentally demonstrated. [ABSTRACT FROM AUTHOR]