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Radio-frequency (RF) hydrogen plasma treatment, thermal annealing in a furnace, and rapid thermal annealing of high-dose P+ ion implanted p-type Ge layers have been studied by Raman scattering spectroscopy, atomic force microscopy, secondary ion mass spectrometry, electrochemical capacitance-voltage profiling, four-point probes method, and x-ray reflectometry. It was shown that low-temperature RF plasma treatment at temperature about 200 °C resulted in full recrystallization of amorphous Ge layer implanted by P+ ions and activation of implanted impurity up to 6.5 × 1019 cm-3 with a maximum concentration at the depth of about 20 nm. Rapid thermal annealing (15 s) and thermal annealing (10 min) in nitrogen ambient required considerably higher temperatures for the recrystallization and activation processes that resulted in diffusion of implanted impurity inside the Ge bulk. It was demonstrated that RF plasma treatment from the samples with front (implanted) side resulted in considerable stronger effects of recrystallization and activation as compared with the same treatment from the back (unimplanted) side. The experiment shows that nonthermal processes play an important role in enhanced recrystallization and dopant activation during the RF plasma treatment. Mechanisms of enhanced modification of the subsurface implanted Ge layer under plasma treatment are analyzed. [ABSTRACT FROM AUTHOR]

Single electron transistors are nanoscale electron devices that require thin, high-quality tunnel barriers to operate and have potential applications in sensing, metrology and beyond-CMOS computing schemes. Given that atomic layer deposition is used to form CMOS gate stacks with low trap densities and excellent thickness control, it is well-suited as a technique to form a variety of tunnel barriers. This work is a review of our recent research on atomic layer deposition and post-fabrication treatments to fabricate metallic single electron transistors with a variety of metals and dielectrics. [ABSTRACT FROM AUTHOR]

The improvement of subthreshold slope due to impact ionization is compared between “standard” inversion-mode multigate silicon nanowire transistors and junctionless transistors. The length of the region over which impact ionization takes place, as well as the amplitude of the impact ionization rate are found to be larger in the junctionless devices, which reduces the drain voltage necessary to obtain a sharp subthreshold slope. [ABSTRACT FROM AUTHOR]

The electric field perpendicular to the current flow is found to be significantly lower in junctionless transistors than in regular inversion-mode or accumulation-mode field-effect transistors. Since inversion channel mobility in metal-oxide-semionductor transistors is reduced by this electric field, the low field in junctionless transistor may give them an advantage in terms of current drive for nanometer-scale complementary metal-oxide semiconductor applications. This observation still applies when quantum confinement is present. [ABSTRACT FROM AUTHOR]

Graphene oxide (GO) films were formed by drop-casting method and were studied by FTIR spectroscopy, micro-Raman spectroscopy (mRS), X-ray photoelectron spectroscopy (XPS), four-points probe method, atomic force microscopy (AFM), and scanning Kelvin probe force (SKPFM) microscopy after low-temperature annealing at ambient conditions. It was shown that in temperature range from 50 to 250 °C the electrical resistivity of the GO films decreases by seven orders of magnitude and is governed by two processes with activation energies of 6.22 and 1.65 eV, respectively. It was shown that the first process is mainly associated with water and OH groups desorption reducing the thickness of the film by 35% and causing the resistivity decrease by five orders of magnitude. The corresponding activation energy is the effective value determined by desorption and electrical connection of GO flakes from different layers. The second process is mainly associated with desorption of oxygen epoxy and alkoxy groups connected with carbon located in the basal plane of GO. AFM and SKPFM methods showed that during the second process, first, the surface of GO plane is destroyed forming nanostructured surface with low work function and then at higher temperature a flat carbon plane is formed that results in an increase of the work function of reduced GO. [ABSTRACT FROM AUTHOR]