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Conformal atomic layer deposition (ALD) inside macroscopic nanoporous solids with aspect ratios greater than 103 can require ALD reactant exposures on the order of 103 Torr-s or greater. For some ALD chemistries, such large exposures raise the concern of non-self-limiting deposition. In the case of ZnO ALD from diethylzinc (DEZ) and H2O, exposures in the 10–103 Torr-s range have resulted in metallic Zn deposition at typical temperatures used for ZnO ALD on wafers (e.g., ∼180 °C). This Zn deposition can be suppressed by lowering the deposition temperature, but this slows H2O desorption and, thus, can necessitate impractically long purge times. In this work, we use static-dose ALD with DEZ and H2O exposures >104 Torr-s to deposit ZnO inside Al2O3 nanoparticle compacts (NPCs) with 50.5 ± 0.3% porosity, 100 nm NP diameter, 1.55 ± 0.05 mm thickness, and an aspect ratio of 7800 ± 200 (based on the half-thickness), and we explore a novel approach to the deposition temperature, T: T is cycled between 160 °C (for H2O purges) and 120 °C (for all other steps). For comparison, we also deposit ZnO with T held constant at 120 or 160 °C. Whereas the T = 160 °C process results in Zn metal deposition and nonuniform infiltration, the temperature-cycled process yields apparently self-limiting ZnO deposition at a growth per cycle (GPC) of ∼2.1 Å/cyc, forming an electrically conductive ZnO network that is uniform throughout the thickness of the NPC, with the exception of some ZnO depletion near the NPC surfaces, possibly due to the (unoptimized) long DEZ purge time. The T = 120 °C process produces similar results, although the GPC is slightly elevated, indicating diminished removal of H2O and/or OH during purges. We employ scanning electron microscopy with energy-dispersive x-ray spectroscopy, x-ray diffractometry, electrical resistivity measurements, and ALD chamber pressure analysis in our comparison of the three ALD processes. [ABSTRACT FROM AUTHOR]

Electron emission from quasi-freestanding bilayer epitaxial graphene (QFEG) on a silicon carbide substrate is reported, demonstrating emission currents as high as 8.5 μ A, at ∼200 °C, under 0.3 Torr vacuum. Given the significantly low turn-on temperature of these QFEG devices, ∼150°C, the electron emission is explained by phonon-assisted electron emission, where the acoustic and optical phonons of QFEG causes carrier acceleration and emission. Devices of differing dimensions and shapes are fabricated via a simple and scalable fabrication procedure and tested. Variations in device morphology increase the density of dangling bonds, which can act as electron emission sites. Devices exhibit emission enhancement at increased temperatures, attributed to greater phonon densities. Devices exhibit emission under various test conditions, and a superior design and operating methodology are identified. [ABSTRACT FROM AUTHOR]

The electrochemical detection of heavy metal ions is reported using an inexpensive portable in-house built potentiostat and epitaxial graphene. Monolayer, hydrogen-intercalated quasi-freestanding bilayer, and multilayer epitaxial graphene were each tested as working electrodes before and after modification with an oxygen plasma etch to introduce oxygen chemical groups to the surface. The graphene samples were characterized using X-ray photoelectron spectroscopy, atomic force microscopy, Raman spectroscopy, and van der Pauw Hall measurements. Dose–response curves in seawater were evaluated with added trace levels of four heavy metal salts (CdCl2, CuSO4, HgCl2, and PbCl2), along with detection algorithms based on machine learning and library development for each form of graphene and its oxygen plasma modification. Oxygen plasma-modified, hydrogen-intercalated quasi-freestanding bilayer epitaxial graphene was found to perform best for correctly identifying heavy metals in seawater. [ABSTRACT FROM AUTHOR]

Nanocrystalline tin sulfide (SnS) thin films were deposited by electron-beam evaporation at growth temperatures ranging from room temperature to 300 °C and characterized prior to and after annealing at 300 °C in high vacuum. X-ray diffraction and Raman spectroscopy results indicated that SnS films deposited at 100 and 200 °C contained predominately a mixture of orthorhombic α-SnS and cubic π-SnS phases, whereas only α-SnS was detected in SnS films deposited at 300 °C. Contacts with a range of work functions were deposited onto p-type α-SnS films. All of the contacts investigated (Ti/Au, Ru/Au, Ni/Au, and Au) were ohmic as-deposited and yielded average specific contact resistance values that decreased with increasing metal work function, suggesting that the barrier height has at least a partial dependence on the work functions of the metals. Annealing at 350 °C for 5 min in Ar reduced the specific contact resistance value for Ru/Au contacts, resulting in the lowest value (1.9 × 10−3 Ω cm2) of contacts investigated to SnS thin films. [ABSTRACT FROM AUTHOR]