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High mobility bottom gate thin film transistors (TFTs) with an amorphous gallium tin zinc oxide (a-GSZO) channel layer have been produced by rf magnetron cosputtering using a gallium zinc oxide (GZO) and tin (Sn) targets. The effect of postannealing temperatures (200, 250, and 300 °C) was evaluated and compared with two series of TFTs produced at room temperature (S1) and 150 °C (S2) during the channel deposition. From the results, it was observed that the effect of postannealing is crucial for both series of TFTs either for stability as well as for improving the electrical characteristics. The a-GSZO TFTs (W/L=50/50 μm) operate in the enhancement mode (n-type), present a high saturation mobility of 24.6 cm2/V s, a subthreshold gate swing voltage of 0.38 V/decade, a turn-on voltage of -0.5 V, a threshold voltage of 4.6 V, and an Ion/Ioff ratio of 8×107, satisfying all the requirements to be used as active-matrix backplane. [ABSTRACT FROM AUTHOR]

We report high-perfomance ZnO thin-film transistor (ZnO-TFT) fabricated by rf magnetron sputtering at room temperature with a bottom gate configuration. The ZnO-TFT operates in the enhancement mode with a threshold voltage of 19 V, a saturation mobility of 27 cm2/V s, a gate voltage swing of 1.39 V/decade and an on/off ratio of 3 × 105. The ZnO-TFT presents an average optical transmission (including the glass substrate) of 80% in the visible part of the spectrum. The combination o f transparency, high mobility, and room-temperature processing makes the ZnO-TFT a very promising low-cost optoelectronic device for the next generation of invisible and flexible electronics. [ABSTRACT FROM AUTHOR]